Latest Posts
Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program
Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of...
Taking 3D Integration to the Next Level
There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t... IRT Nanoelec Partners Achieve 3D Chip-stacking Technology and 3DNoC Framework for Digital Processing
GRENOBLE, France – July 09, 2015 – IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using...
2013 ITRS Roadmap Calls for 3D Power Scaling; Monolithic 3D Gains Traction
At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS), which has traditionally...
3D TSV without Limits
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization...
European 3D TSV Summit: 3D TSVs Come of Age
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...Tour de France in 3D – Day 3
When it comes to fully understanding 3D integration processes, Sarah-Lyle Dampoux (my tour...Coffee Break with Nicolas Sillon, CEA Leti
The day after Nicolas Sillon presented his keynote at IWLPC on interposer technology, we sat down to coffee and a...
