The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023 IMAPS...
Santee, Calif. — StratEdge Corporation,leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and...
The Most Comprehensive Program for Microelectronics and Advanced Packaging This Spring The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16,...
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
IMAPS 2022 Continued… This year’s IMAPS Symposium in Boston drew 925 attendees and featured: 20 technical and poster sessions 11...
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some...
Founder’s Award honors individuals who have made the most significant contributions to the microelectronics packaging industry Tempe, Ariz. – October...
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
Are you listening to the 3D InCites podcast yet? We had a busy summer! Our listenership grew, and we achieved...
Experts available at BCICTS 2022 and IMAPS 2022 to analyze your high-frequency packaging needs Santee, Calif. — 9 September 2022 — StratEdge...
The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve...
Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6...
Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP...
Oh, how I missed those hallway conversations! And last week’s IMAPS International Symposium 2021 did not disappoint. It was so...
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations...
In a global industry that relies heavily on collaboration, COVID 19 created a big pause and pivot in one of...
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...
I have finally been in this industry long enough to understand the cycle of discussion, scrutiny, call to arms, and...
iMAPS: Enabling a Connected World: Always On! 3D InCites will be participating in the iMAPS 2020 virtual symposium, October 5-8,...
