CoWoS

Image Courtesy of TSMC Ltd.

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience with alliance management and ecosystem building, I see TSMC as the master of these discipl... »

Image Courtesy of TSMC Ltd.

TSMC’s OIP Symposium 2016

After a fairly long vacation it’s very hard to get back to work. That’s why I was really glad that this year’s OIP Symposium helped me – right after touring Europe for 3 weeks – to finding my groove again. Allow me to share some of my observations at and thoughts about the Symposium, from my “More-than-Moore EcoSystem builder” perspective. The collaborative innovation programs TSMC ... »

TSMC’s Grand Alliance: A Powerful EcoSystem

TSMC’s Grand Alliance: A Powerful EcoSystem

On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress and the power of TSMC’s Grand Alliance. As a former Alliance Manager, I really enjoyed seeing how TSMC’s far-reaching vision and strategic alliances, combined with excellent execution and customer service, made them the largest wafer supplier to fabless IC ... »

ECTC 2015: From the Tech Sessions Part 2

ECTC 2015: From the Tech Sessions Part 2

As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I found very useful to contribute to the advancement of single- and multi-die packaging. To make it easier for the reader to dig deeper and review the entire paper, I included in every summary the paper number, as listed in the program and on the USB stick we received. As I mention in... »

Image Courtesy of TSMC Ltd.

TSMC 2015 Technology Symposium Highlights Plans for the Coming Year

Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium celebrated 21 years of holding this annual event to update TSMC’s loyal customers and win new ones. Rick Cassidy, President TSMC North America, opened the symposium with a long list of impressive numbers about TSMC and put them into context with our Semiconductor industry. For example: TSM... »

2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure

2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure

SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on ensuring that all pieces of the 3D IC puzzle are in place. This was evident from the range of presenters they had lined up during this year’s Technology Forum, held at the The St. Regis San Francisco, 125 3rd St, San Francisco, as part of the company’s SE... »