Latest Posts - Page 3
QP Technologies and Parent Company, Promex Industries Implement Sales and Marketing Reorganization
Rosie Medina named senior VP of sales and marketing Promex; Matt Hansen named VP of sales and marketing at QP...
IFTLE 600: A Notice of Intent from the CHIPS NAPMP
The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States...
SEMICON West 2024: Riding the Generative AI Winds of Change
Deepak Chopra said, “All great changes are preceded by chaos.” Here’s my Aha! moment from SEMICON West 2024: After great...
IFTLE 598: NSTC Update
In February 2024, CHIPS announced that $5B would be spent in the National Semiconductor Technology Center (NSTC) to drive innovation...
The Road to the AI Era Is Paved in Semiconductor Manufacturing Innovation (The TechArena)
“The Road to the AI Era Is Paved in Semiconductor Manufacturing Innovation,” an in-depth white paper written by The TechArena...
QP Technologies™ Expands Die Preparation Business
Adds Fully Automated Dicing Saw to Equipment Line, Enabling Even Greater Precision, Throughput for Die Singulation QP Technologies™, a leading...
IFTLE 596: Advanced Packaging Reshaping the Chip Ecosystem
The Boston Consultant Group (BCG) recently took a look at the impact that advanced packaging is having on the microelectronics...
ECTC 2024: Advanced Packaging Engineers to the Rescue!
If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then...
ASE Introduces powerSiP™ for Transformative Power Delivery
PowerSIP™ increases power efficiencies by 50% in AI and data center applications Advanced Semiconductor Engineering, Inc. (ASE), a member of...
IFTLE 593: Deep in the Heart of Texas
IFTLE has spent a lot of time recently focusing on the availability of U.S. government funds for the “onshoring” of...
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
Fraunhofer IZM Joins Forces with Rapidus for High-End Performance Packaging
Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, and Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022,...
Solving the AI Puzzle
An AI package is like a puzzle made up of individual pieces of different sizes and shapes, each one essential...
Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a leader in power systems and IoT, is strengthening its outsourced backend manufacturing...
IFTLE 589: Intel Gets CHIPS Act Funding; Raytheon and AMD Partner on Multi-Chip Package
The Department of Commerce (DoC) has announced Intel as the fourth program it will fund under the CHIPS and Science...
Balancing Precision and Throughput in 3D Structures with Advanced Packaging and Motion Control
The relentless drive in the semiconductor industry to consistently deliver improved performance and power efficiency has traditionally led to increasingly...
Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
Advanced wafer-level packaging advances the next wave of innovation in global chip manufacturing TEMPE, Ariz. – March 19, 2024 –...
Infineon Sells Manufacturing Sites in Cavite, Philippines and Cheonan, South Korea to ASE
Munich and Taipei – 22 February, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and ASE Technology Holding...
