Latest Posts - Page 2
Schiltron 3D Flash
Schiltron 3D Flash replaces 2D-NAND. It uses a unique architecture solving key challenges associated with other 3D-NAND approaches: scalable; no...
3D NAND Flash – Schiltron’s Answer
It probably appears that the only 3D technologies vying for 2D NAND’s crown are V-NAND from Samsung and p-BiCS from...
News of 3D NAND Fab Construction: A sign of Progress or a PR Ruse?
While I don’t claim to be an expert in 3D NAND technologies, I do keep my eye on what’s happening...
3D NAND Flash: Outlook for 2014
What with all the commotion about 3D NAND and the accompanying cyberspace chorus, you would surely be forgiven in thinking...
Part 3: 3D NAND Flash – Towering Spires or Costly Canyons?
As promised in Part 2 of this series, in this third installment, I’ll continue to wade into the choppy waters...
Part 2: 3D NAND Flash: Towering Spires or Costly Canyons?
In my last blog posting I went over the cost aspects of the Samsung-Toshiba 3D NAND approaches. The conclusion is...
3D NAND Flash – Towering Spires or Costly Canyons?
The transition to 3D NAND Flash seems to be imminent with projections of it being half the total NAND Flash...
The Many Flavors of 3D DRAM
Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in... Comparing Samsung’s 3D NAND with Traditional 3D ICs
At last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob...
