Latest Posts
Siemens Collaborates with TSMC on Design Tool Certifications
Design Tool Certifications Support Newest Processes and Other Enablement Milestones Today at the TSMC 2024 North America Technology Symposium, Siemens...
Five Workflows for Tackling Heterogeneous Integration of Chiplets for 2.5D/3D
Keeping pace with Moore’s law continues to be challenging and is driving the adoption of innovative packaging technologies that support...
Siemens Brings Secure Thermal Digital Twin Technology to the Electronics Supply Chain
Siemens Digital Industries Software is bringing an innovative approach to sharing accurate thermal models of integrated circuit (IC) packages to...
Executive Interview: Si2 Aims to Boost Confidence in Designing 3D ICs
There’s no doubt left in the minds of semiconductor device manufacturers that the processes required to build interposer-based and 3D...
3D By Design: Exploring Viable Path Finding
Fruitful path finding eventually identifies solutions that are viable for mechanical, electrical, thermal, and cost (METC) requirements. Hopefully, more than one...
3D By Design: A Blog By and For the 3D Design Community
Earlier this year, I published an open letter to chip and system-level designers regarding 3D integration, suggesting they consider 3D...
3D Workshop Panel Discussion Focuses on 3D Standards and EDA Tool Readiness
Are slow standardization and CAD-tool development hindering the progress of 3D IC design and integration? This was the topic of discussion...
Catching Up With Steve Breit, Coventor, at the TSensors Summit
A journey of a trillion sensors begins with a single step. The TSensors Summit, held at Stanford University on 23...
And a Good Time was had by All – 3D InCites Awards Breakfast, 2013
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge...
Synopsys: Galaxy Implementation Platform
Product Description Synopsys’ Galaxy™ Implementation Platform is the industry’s leading solution for IC implementation and signoff. Now available with powerful... Apache Design: RedHawk-3DX
Product Description Apache Design’s fourth-generation RedHawk™-3DX simulation software technology extends previous generations’ capabilities to address sub-20 nanometer (nm) designs with... Mentor Graphics: Calibre
Product Description Calibre enables signoff verification of chip stacks with flip chips, silicon interposers and through-silicon vias (TSVs). Verification of...
Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5D/3D-ICs
WILSONVILLE, Ore., May 20, 2013—Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate...Talkers vs. Doers in the 3D IC World
Are there still people who are clueless about 3D? Apparently there are. Lots of them. Despite all the discussion and attention 3D...TechVenture Forum covers 3D from A-Z
I just took a good look at the line-up for the 3-D Architectures for Semiconductor Integration and Packaging, coming up...