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By Till Dreier and Julius Hållstedt, Excillum Complex architectures with intricate interconnects, stacked dies, and buried features – the recent developments in advanced packaging come with great possibilities but also challenges. From off-line Failure Analysis (FA) to at- and in-line inspection in manufacturing — more efficient and higher resolution methods...
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member companies. There’s nothing like talking to the experts face-to-face and walking through a cleanroom or advanced packaging applications lab to drive home a concept. For the past year, I’ve been...
Bridging the gap: innovations in chiplet interconnect technology Chiplet interconnects begin with small chips – or chiplets – with a well-defined function that can be incorporated with other chiplets into a single package or system Dense interconnections between chiplets ensure fast, high-bandwidth electrical connections. This article discusses both interposer and...
If you have been following the announcements from Bob Patti and his company, NHanced Semiconductors, it would not be surprising if you were a bit confused about how all these announcements will be coming together. I know IFTLE was, so we approached longtime friend Bob Patti and came up with...
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose. Right out of the gate, it reminded me of the early days of RTI’s 3D ASIP Conference that I attended for nine straight Decembers in Burlingame, CA. The single-track format...
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS Device Packaging Conference (IMAPS DPC). With over 400 attendees, it felt like the good old days. While it wasn’t the first in-person conference we’d attended; it did feel more like...
See that title? That was only part of how I spent last Thursday (December 3). My morning started with the monthly Global SemiSister Social Hour, segued right into Yole’s Webinar about 3D packaging breakthroughs, then it was on to The GSA Awards (I have never been to the live awards...
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received multiple orders for its GEMINI® FB XT automated fusion wafer bonders from multiple leading device manufacturers. The GEMINI FB XT offers industry leading wafer-to-wafer alignment...
Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets. In visits I’ve made to EVG’s Schaerding, Austria world headquarters over the years, it’s clear that this Triple I approach is working for the company, which...
