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According to Nikkei Asia, UMC is eyeing 6nm production, with a focus on chips for Wi-Fi, RF, Bluetooth, AI accelerators, and processors used in TVs and vehicles. In 2017, UMC began to focus on mature process nodes rather than competing at leading-edge technologies dominated by TSMC. This allowed UMC to...
The semiconductor industry is rapidly advancing, with an increasing emphasis on cutting-edge packaging techniques such as heterogeneous integration (HI), 3D heterogeneous integration (3DHI), and chiplets. These innovations necessitate efficient, cost-effective, and damage-free debonding processes to ensure high-yield manufacturing. Conventional mechanical and laser-based debonding methods often introduce challenges such as thermal...
Get ready, because the IMAPS International Symposium on Microelectronics is coming up quickly. As the event continues its very impressive run of 57 years, this year’s symposium will take place from September 30 – October 3 at the Encore Boston Harbor. With 15 3D InCites Community Members presenting and 20...
EV Group and Fraunhofer IZM-ASSID partnership kicks off with the installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Fraunhofer...
Company expansion driven by market growth in 3D/heterogeneous integration fueling strong demand for EVG hybrid bonding and other leading process solutions FLORIAN, Austria, November 28, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction...
This week, we continue our look at the presentations at the IMAPS CHIPCon conference that was held at the end of July 2023. Here we focused on process tools and EDA for chiplets. Hybrid Bonding at Besi Besi is a global leader in equipment for advanced packaging assembly and equipment...
Before I could start writing my blog post about the keynote talks delivered at the 2021 Virtual IMAPS Device Packaging Conference, I first had to find out what an XPU was. I’m often stymied by this industry’s penchant for acronyms and my journalistic need to write them out in the...
Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer DBI. Excited to celebrate this momentous occasion with them, I even wore the Xperi logo for the photo. Here we are a year later, and although I won’t have the...
Of all the companies that have supported 3DInCites over the past 10 years, none has been more consistently involved, both as contributor and sponsor, as EV Group. In fact, without EVG’s belief in our mission and their sponsorship the first three years, I doubt 3DInCites would still exist today. Therefore,...
Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately...
