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If we look back, almost a decade ago, 3D stacked memory was all the rage, and the leader in stacked memory development appeared to be Micron and their highly advertised hybrid memory cube (HMC) which was announced at the 2011 Hot Chips Conference. HMC featured a low-width bus & extremely...
Let’s look at a few more presentations from the SEMI 3D & Systems Summit which was held in late January in Dresden. KLA showed this interesting schematic of where inspection was necessary for high-density 2.5/3D packaging. Embedded Chip Technology AT&S gave an interesting presentation on “Heterogeneous Module Integration using Embedded...
More than 90% of all traffic deaths are caused by human error.1 I’m sure you’ve all heard this statistic repeatedly over the past few years. After all, this 2016 finding by the US National Highway Traffic Safety Administration (NHTSA) is fueling the semiconductor industry’s mission to develop the automotive electronics...
Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density, and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have...
Yole Développement (Yole) power electronics team’s presents this year an optimistic analysis of the power electronics industry. The power device market is showing a comfortable 13.9% growth between 2018, compared to 2017. The market research & strategy consulting company points out a second consecutive high-growth year in this industry, after...
At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP (FO PLP)...
Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic footprint and manufacturing capabilities by taking over the operations of Deca Technologies’ Philippines manufacturing facility. The investment will permit the expansion of the WLCSP capacity already in mass...
It was exactly a year ago that GLOBALFOUNDRIES’ announced that they would no longer be competing in the node scaling race. I wrote that up in IFTLE 395, the last IFTLE post written for Solid State Technology whose parent, Extension Media was headed for bankruptcy. I cannot give you the...
SEMICON West and the Electronic System (ES) Design West were, for the first time, co-located at the Moscone Center in San Francisco, from July 9 to 11, 2019. In addition to most keynotes, I reported about here, This blog talks about some in-depth technical presentations on test and the progress...
The expected increase of the power device market, with a compound annual growth rate (CAGR) of more than 10% — and more particularly insulated-gate bipolar transistor (IGBT) products for automotive and other applications — is pushing the semiconductor industry to adopt specific process solutions. The maturity of IGBT market, boosted...
