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There are two key components to the ability to continue scaling integrated circuits (ICs): The ability to increase transistor density transistor and keep it functioning properly, and the ability of the interconnect to move the electrons from the transistor to the other ICs, or systems to which the logic chip...
From basic webinars and Zoom happy hours (like our SemiSister Social Hour above), to full-blown technical conferences, trade shows, and even some hybrids, we’ve all been dabbling in virtual events for about six months now. But based on the emails flooding my inbox, we ain’t seen nothin’ yet. But Wait…...
Back in the late summer of 2018 IFTLE unleashed one of its more sarcastic cartoons to note that GlobalFoundries had just announced it would no longer try to compete at the latest node. (See IFTLE 395 “And Then There Were 3…”) Is Intel Next? Well, the remaining three mega players...
LAYERS 5, from Evatec, is your guide to all the latest thin-film technology news across advanced packaging, semiconductor, 0ptoelectronics, and photonics. Read about developments at Evatec Learn about changes in our capabilities and processes that support our customers better for the future. Advanced Packaging Read contributions from guest authors SEMCO...
I first met Dr. Thomas Fries, Founder, and CEO of FRT, The Art of Metrology in 2016 at SEMI Europe’s 3D Summit in Grenoble. Fries became a big fan of 3D InCites, following us on social media, and sharing our content. Over the next few years, Fries and the team...
The pandemic made this a unique year for ECTC. To my knowledge, it is the first time that the in-person conference had to be canceled, and I am certain it is the first time the conference was held as a virtual event. While it was a disappointment to cancel the...
This morning at Virtual SEMICON West, I tried to attend a bunch of sessions and take notes so I could write about them. I really did. But I was experiencing information overload. And so, I decided to just listen to and watch a few, and maybe go back to the...
In a recent IMAPS webinar, John Park (Figure 1), product management director of Cadence Design Systems, gave a tutorial entitled “This Is Not Your Father’s Advanced Semiconductor Packaging…an EDA Perspective”. Herb Reiter reviewed it here. While a lot of the technical detail that he shared was probably beyond the older...
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
Funny how language works and how new terms enter our lexicon. IFTLE is not a supporter of buzzwords. As a matter-of-fact, we detest buzzwords about as much as we detest political correctness. We all heard the term nanotechnology used until it nearly made us gag. For me, ditto the use...
