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Looking at Global Semiconductor Expansion Through Polarized Lenses

The song, Happiness is Lubbock Texas in My Review Mirror, has a special meaning for me, as due to a Texas ice storm, a day trip to Lubbock, TX was extended. Thanks to a determined Southwest Airlines team, a group of us managed to get home only a day later,...

Congratulations to the Winners of the 2022 3D InCites Awards!

It is my honor to announce the winners of the 2022 3D InCites Awards. With 51 nominees in 11 categories, we had more participation than ever, and the competition was fierce! Thank you to this year’s platinum sponsors, ASE Group, EV Group and KLA; our gold sponsors, Evatec and YES, and...

IFTLE 505: What Does 6G Mean for Advanced Packaging?

At the recent IMAPS virtual/live hybrid meeting from San Diego, I was most interested in the workshop run by Fraunhofer IZM on what 6G telecom means for Advanced Packaging. Let’s take a closer look at the presentation by Ivan Ndip . 5G appears in multiple forms (Figure 1) Breakthrough 5G...

How Do We Reduce the Semiconductor Carbon Footprint?

Certain companies in the semiconductor industry have focused on sustainability for a significant period of time. ST Microelectronics and Intel have long records of focusing on water conservation and programs to reduce power. However, the Paris Accord and the recent article published in Bloomberg, accusing the semiconductor industry of having...

Lam Research Unveils Syndion GP to Help Chipmakers Meet Demand for Advanced Power Devices

Expanding Company’s Leadership in Deep Silicon Etch Technology, New Semiconductor Manufacturing Solution Supports Development of Chips for Automotive and Smart Technologies FREMONT, Calif., Dec. 7, 2021 – Lam Research Corp. (NASDAQ: LRCX) today announced Syndion® GP: a new product that provides deep silicon etch capabilities to chipmakers developing next generation power...

Adaptive Control: The “Holy Grail” in Semiconductor Smart Manufacturing

Artificial intelligence and machine learning (AI/ML) can have various applications in smart manufacturing for semiconductor fab, advanced packaging, and electronics manufacturing, and it typically involves several key elements: sensing, connectivity, predicting, and control. As recognized by many industry organizations, smart manufacturing matures through several levels: reactive, preventive, predictive, and autonomous...

IFTLE 498: Sapphire Rapids – Intel Chiplet Architecture Begins

X-FAB – First Foundry to Offer Micro Transfer Printing Before we take a look at Intel’s Sapphire Rapids, a quick update on micro-transfer printing (MTP) [ see IFTLE 484, “Massively Parallel Pick & Place from the X-Men”] X-FAB, the analog/mixed-signal and specialty semiconductor foundry, has announced it has made substantial...

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3D InCites Launches WeChat Platform

Audiences in China have no access to social media apps like Facebook, Twitter, YouTube, and Instagram, but they’ve completely embraced the WeChat platform. Launched in 2011 by Tencent, WeChat has grown from a messaging app to a unique social media hybrid. It forms the basis of the daily digital life...

Will An Adhesion Promoter Prevent Delamination

Will An Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?

Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is...

Holy San Francisco Batman, SEMICON West 2021 will be held in December!

This past week SEMI announced that SEMICON West 2o21 will be a hybrid affair with both a live conference and virtual views possible. The show will be held December 7-9, 2021. The usual July show will be canceled this year, but according to Dave Anderson President of SEMI America, will...