Matches for your search: "hybrid bonding "
Research collaboration to bring greater use of artificial intelligence and cloud computation in the world’s most comprehensive digital twin across electronics systems based industry sectors Siemens Digital Industries Software and CEA-List, a technological research institute focused on smart digital systems research, announced today the signing of a memorandum of understanding...
September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international conference in September. The Institute that now employs more than 400 people at its three sites was founded by twenty-one German scientists on a mission. Its main site in the...
We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of PHOTONICS CHINA and will present at the LaserFocusCon laser technology and application seminar. MRSI will exhibit at LASER World of PHOTONICS CHINA from July 11-13, 2023, in Hall 7, Booth #7.1B141 of the National...
SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries gather July 11-13 at the Moscone Center in San Francisco. The event focuses on key challenges affecting the global microelectronics industry which include Supply Chain Disruptions, Climate Change, and Talent...
Our 3D InCites Community Members had an abundant amount of news to share this month, so we thought we should do a quick recap in our June edition of monthly highlights. If you have news to share, please don’t forget to share it with your 3D InCites team! ASE announced...
Melville, NY (May 2, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical, energy, industrial and other applications, today announced the acquisition of Technograph Microcircuits Ltd, (“TechnoGraph” or the “Company”), a leading provider of hybrid integrated circuits, RF &...
Samsung Foundry Forum Moonsoo Kang, Head of Business Development at Samsung Foundry, at the 2022 Samsung Foundry Forum (SFF) explained that they would be using advanced heterogeneous integration as a method of streamlining and improving the process of integrating separately manufactured chip components into a single assembly level. Figure 1...
On December 29, 2022, Infostone 2022 Annual meeting and the 9th Heroes List award live conference was successfully held. During the conference, Infostone announced the 9th heroes company list in four categories: “The Most Competitive Products of Optical Communication”, “Excellent Quality Award”, “Outstanding Technology Award” and “Recommended Brand Award”, which...
Acquisition Expands Micross’ High-Reliability Power Management Solution Capabilities Melville, NY – January 10, 2023 – Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today announced signing...
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration in Europe. The conference takes place every two years and is the IEEE EPS flagship conference in Europe, organized by IEEE EPS Region 8 (EMEA) Chapter in association with IMAPS...
