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EV Group Lithography Solutions for Heterogeneous Integration and Wafer-level Packaging to Be Highlighted at ECTC 2022

May 25, 2022

Technical papers to highlight the breakthrough capabilities of EVG’s LITHOSCALE® maskless lithography solution and OmniSpray® resist coating technology for “More than Moore” applications EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration...

Is Fan-Out packaging still popular? Equipment +; material companies are the heartbeats of this ecosystem

Sep 18, 2019

“Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established in low-end and high-end applications”, asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “It has proven benefits in terms of form factor with no IC substrates, performances...

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

May 21, 2019

Technical papers and interactive poster to highlight the breakthrough capabilities of EVG’s ComBond® high-vacuum bonding system and low-temp laser debonding solution for “More than Moore” applications EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new...

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Mar 26, 2018

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM) / redistribution layer (RDL) challenges. This article looks at AP trends from a lithography standpoint and proposes solutions to associated lithography challenges. The need for advanced packaging solutions is greater...

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

Oct 27, 2017

To the best of my recollection (and a quick search through 3D InCites’ archives) the panel level packaging (PLP) hoopla first hit the conference circuit in 2015 at the International Wafer Level Packaging Conference (IWLPC), when Jan Vardaman made it the topic of a panel discussion, and told a cautionary...

The Advanced Packaging Times, they are A-Changing…or Are They?

Apr 05, 2017

It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had plenty of time to mull over the many presentations and conversations focused on advanced packaging trends. The winds of change are blowing ever so slightly from year’s past. You had...

Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!

Mar 13, 2017

Here we go again! One thing is for sure, there is never a dull moment at the IMAPS Device Packaging Conference panel sessions. (Remember the year of Alphabet Soup?) Maybe it’s because they take place AFTER everyone’s had a few drinks, but this year was especially lively and entertaining. There was...

Pasadena offers Roses and Technology

Oct 18, 2016

California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It takes commitment and organizational talent to make these events successful for 100+ years, and encourage every contributor to prepare and execute successful events every year. Last week’s International Microelectronics Assembly...

1551 Industry Experts Demonstrate at ECTC: IC Packaging Technology is Essential for Success

Jun 05, 2015

Last week I attended the record-breaking 65th ECTC in San Diego: 20 percent more attendees, compared to last year’s conference in Orlando. Once again, this year’s event offered a wide range of topics in six tracks. I spent most of my time in the “Advanced Packaging” track and was in...

A Breakfast of Cu Pillars, Wafer-level Packaging the Internet of Things, and more

Oct 21, 2013

I took a detour to work on Friday (Oct 18, 2013), stopping in at Freescale Semiconductor (Tempe AZ) to attend the Arizona SEMI Breakfast Forum. The topic was right up my alley: (which is why I went, of course!) “New Advanced Packaging Insights on Technology and Applications“. Featured speakers included...