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The YES RapidCure tool, based on an exclusive license to the process created by Deca Technologies, is a combination of UV and direct thermal exposure that significantly reduces process cycle time. YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, today announced that SkyWater Technology...
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This year’s symposium will feature five technical tracks, professional development courses and an interactive poster session. The technical program spans three days of sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level/Panel...
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference (ECTC) in Orlando. I have counted 24 companies with booths, and even more presenting papers. It’s going to be the best three days in packaging, components, and microelectronic systems science,...
Electronics Packaging vs. Advanced Packaging Electronics packaging is generally divided into three major areas, traditional packaging – also called standard or mainstream packaging, and sometimes even just “Others”: advanced packaging and emerging packaging technologies. Traditional packaging is everything with wire or ribbon bond interconnects on a ceramic, metal lead frame,...
Fan out (FO) packaging is one of the key growth segments in advanced packaging, with high adoption rates and strong technology advantages offering a strong pathway moving forward to support industry roadmaps. The nature of reconstituted substrates is now enabling fan-out panel-level packaging. Fan out packaging is no longer limited...
More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is being driven by the consumer markets as smartphones, tablets and many handheld devices require advanced features in light and thin products. Currently, those requirements are being fulfilled by fan-in or...
Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced packaging. One thing that I’ve heard over the past year is that as 3D technologies move into manufacturing, it’s become difficult to recruit speakers who have fresh content. Notoriously slow...
Fan-in packaging has been a successful and steadily growing platform for over a decade. However, fan-in packaging should face a challenging future, announces Yole Développement (Yole), the “More than Moore” market research and strategy consulting company. Indeed, despite unchanged market drivers, Fan-In packaging is showing an uncertain future with a...
NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, today announced that it has received an order from NANIUM, S.A., a Portugal-based semiconductor manufacturing, test and engineering services provider, for a 300mm Sigma fxP...
Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel fan-out manufacturing line. The JetStep S Series Lithography System was selected after a thorough evaluation...
