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November was a dynamic month for the 3D InCites community and the broader semiconductor industry, with companies showcasing innovative technologies, celebrating leadership achievements, expanding global operations, and advancing workforce development. From product launches and AI‑enhanced design platforms to award recognitions and strategic partnerships, industry leaders highlighted breakthroughs in advanced packaging, inspection,...
In IFTLE 626 we looked at the Yole article that addressed the question of whether panel level processing was finally coming on line. In this blog we will take a look at some of the work Amkor is doing on what they are calling hybrid panel level technology. But before...
The Boston Consultant Group (BCG) recently took a look at the impact that advanced packaging is having on the microelectronics chip ecosystem. Let’s take a look at some of the points that they make. Advanced packaging is replacing simple “scaling”, which had been the traditional way to achieve advancements in...
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device Packaging Conference (DPC), is scheduled from March 18 to 21 in Fountain Hills, AZ. Simultaneously, the Workshop on Advanced Packaging for Medical Microelectronics will take place at the WeKoPa Resort...
SK Hynix Advanced Packaging Ki-ill Moon, head of Packaging Technology Development at SK Hynix recently wrote an article for EE Times entitled “ The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration” that is certainly worth taking a closer look at. The theme of the article is...
SEMICON Europa is back! On the agenda? The latest innovations and smart applications powering the next wave of semiconductor industry growth, including leading-edge technologies such as artificial intelligence (AI), 5G and robotics. SEMICON Europa 2021, co-located with Productronica, will examine how the semiconductor industry can integrate environmental and social sustainability...
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications such as artificial intelligence (AI), augmented/virtual reality, and autonomous driving require enormous computing power with processors optimized specifically for each application. At the same time, development cycles are becoming shorter, costs for new chip...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on...
To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies. Leaders in the advanced packaging industry have identified new solutions enabling more and more functionalities to be integrated along with many devices in the same...
Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications St. Florian, AUSTRIA, March 27, 2012 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies,...
