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EVG celebrates 30th anniversary of its North America subsidiary in Arizona EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is highlighting the latest developments in hybrid bonding, maskless lithography, metrology and nanometer-precision layer...
While the COVID-19 pandemic has continued to cause mass disruption to the global economy during the past year, one notable bright spot has been within the semiconductor industry, where fab spending in new process equipment reached a new record high of more than $100B according to SEMI. This spending growth...
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first person to show me what a TSV wafer looked like when I visited CEA-Leti’s cleanroom in 2009 during my Tour de France in 3D. At the time, she was a...
Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so I can be brief and focus on the most advanced program presented, the CEA Leti CoolCube™ . Olivier Billoint showed and explained how Leti, in cooperation with an EDA partner, is...
I don’t usually write about MEMS. But every once in a while, when MEMS (stands for micro-electromechanical systems) touches anything to do with 3D integration, usually at the system-level, I might veer slightly out of my comfort zone to interview a MEMS supplier about their latest developments. I find it’s...
Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. announced today that it has received a large order from one of Taiwan’s providers of independent semiconductor manufacturing services in assembly and test (OSAT) for 2D/3D inspection systems. The order includes: multiple NSX® systems for two-dimensional (2D) macro defect inspection, the Wafer...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known in the 3D IC world for its high accuracy die bonder for die-to-die and die-to-wafer stacking. The SET Representative in North America (SETNA) has also launched a companion tool, ONTOS7,...
Redesigned, Fully Automated Modular System Integrates Unmatched Spray Coating Processes for MEMS, Compound Semiconductors and Advanced Packaging SEMICON TAIWAN, Taipei, September 4, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation EVG150 automated resist...
Ziptronix Inc., the leading developer of direct bonding technology for advanced semiconductor applications, announced today that recent collaborations with major image-sensor manufacturers have shown that the Ziptronix ZiBondTM direct bonding process contributes minimum distortion in backside illuminated (BSI) image sensors. “In addition to confirming that the Ziptronix direct bonding technology
SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining...
