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Members of the 3D InCites community hit the year running by celebrating milestones, new hires, promotions, and grand openings. Here are some highlights that caught our attention. Amkor Technology, Inc. hosted DesignCon2024 at the Santa Clara Convention Center in Santa Clara, CA Among the speakers was Amkor’s Ruben Fuentes, VP...
A Conversation About Leadership with SEMI CEO Ajit Manocha For the past few years, we’ve heard semiconductor market analysts prognosticate that based on estimated demand, semiconductors have the potential to become a $1Trillion industry in the next 7-10 years. This number is based on analysts’ projections of driving markets including...
As IFTLE has explained previously, Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS for America program, agreeing with this premise, has announced that it will support the development of advanced packaging technology in the United States that can be transferred to manufacturing facilities, including recipients...
2023 was a year of growth and change for 3D InCites, as well as me personally. In April, I left my role at Kiterocket and the security of a salary and benefits to follow my passion and focus full-time on supporting the 3D InCites Community. It was time, and I...
It all depends upon who you talk to at IEDM 2023. The semiconductor chip industry is either moving into a new realm that will be based upon chiplet technology, or the industry is continuing to drive front-end and backend technology forward and the two technologies are morphing together to drive...
TEMPE, Ariz. – Dec. 12, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, announced today that it has committed to achieving net zero greenhouse gas emissions by 2050. The net-zero goal aligns with the rigorous standards set by the Science Based Targets initiative (SBTi),...
At SEMICON Europa 2023, we heard more good news about 3D heterogeneous Integration from speakers at the CEO Summit and the Advanced Packaging Conference. Not only has it become the champion for the continuation of Moore’s Law scaling, but it also allows us to deliver on power performance area and...
Leoben, October 5, 2023 – The Styria-based technology group is economically successful in challenging times and has an excellent reputation as an employer. This has been confirmed by the Reputation Report 2023, which was drawn up by the Austrian Institute for Management and Economic Research (IMWF Austria) and the trade...
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This year’s symposium will feature five technical tracks, professional development courses and an interactive poster session. The technical program spans three days of sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level/Panel...
2024 Adele Hars Award for DEI Finalists The Adele Hars Award for Diversity, Equity, and Inclusion recognizes a company in the semiconductor and microelectronics industries demonstrating best practices to provide a workplace where diversity, equity, inclusion, and belonging are paramount. Formerly known as the SemiSister Award for DEI, the award...
