Press Releases

Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will...

Brewer Science Joined the Next-Generation Semiconductor Packaging Consortium “JOINT3”

JOINT3 is a co-creation evaluation platform established by Resonac Corporation with the aim of accelerating the development of materials, equipment,...

MacDermid Alpha Showcases Breakthrough Materials for Advanced Packaging and Power Semiconductors at SEMICON Taiwan

MacDermid Alpha presents advanced packaging and power semiconductor materials at SEMICON Taiwan, highlighting reliability, sustainability, and expert insights at the...

MRSI Mycronic to Showcase High-Speed Assembly Solutions at CIOE 2025

MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions at the 26th China International Optoelectronic Exposition (CIOE)...

Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West

Koh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements...

EV Group Promotes Cindy Lee to General Manager of EVG Taiwan Subsidiary

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...

Koh Young Highlights the Market Driven Nova Series and Smart Factory Solutions at Productronica India 2025

Koh Young, the global leader in True 3D measurement‑based inspection and smart factory platforms, is poised to highlight its cutting‑edge technologies...

Koh Young Hosts First Technical Review Meeting at New Taiwan Office to Showcase Advanced Metrology and Inspection Solutions

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is inviting semiconductor and SMT professionals...

Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility

Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the...

Koh Young Expands Global Footprint with Grand Opening of Taiwan Office to Serve Semiconductor and Advanced Packaging Market

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the grand opening of...

Koh Young Highlighting Award-Winning True3D Inspection Solutions at SMTA Guadalajara Expo

Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will showcase its full portfolio of award‑winning inspection...

Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, and High-Performance Computing

Presentations at SEMICON Taiwan 2025 demonstrate how materials impact sustainability, artificial intelligence, and high-performance computing Brewer Science, Inc., a global...

SEMICON Europa 2025 Spotlights Global Collaborations for European Economic Resilience

Registration Open for 50th Anniversary Edition in Munich SEMICON Europa 2025, co-located with productronica, will return to Munich from November 18-21 to...

Indium Corporation Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with...

StratEdge to Display Packaging Innovation at European Microwave Week Exhibition

3F Energy appointed to serve customers across Europe; see us at Booth A095. StratEdge Corporation, leader in the design and production...

Indium Corporation to Showcase Innovative Materials Enabling AI Technology at SEMICON Taiwan

Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, AI, thin-film, and thermal management markets,...

NHanced Semiconductors & University of Florida to Present Chiplet Paper at 36th Electronics Packaging Symposium Held at GE’s Aerospace Research Campus

The paper presents a comprehensive technical roadmap and process assessment of using hybrid bonding to integrate fine pitch chiplet architectures ...

SEMICON West 2025 CEO Summit Keynote Program to Explore Trends Shaping the Global Semiconductor Industry

SEMI Announces Session and Speaker Lineups Headlined by Arizona Governor and Global Tech Executives    SEMI, the industry association serving...