Passing the Torch: Reflections from SEMICON Europa 2025
Nov 24, 2025 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 14
Executive Viewpoint: Why the European 3D Summit is Going Beyond TSVs
Remember back a few years ago when 3D and TSV were considered to be the pretty much the same thing?...
Questions Answered at the 2015 MEMS Executive Congress
This final post from my time at the 2015 MEMS Executive Congress addresses some random questions I had that were...
Cool Stuff at the MEMS Executive Congress 2015
Each year the MEMS Industry Group (heretofore known a the MEMs and Sensors Industry Group), turns the spotlight on some...
System-level Scaling: UCLA’s Answer to Extending Moore’s Law
“We are at a crossroads. Current chip design is nearing its capacity. The time, expense, and effort needed to make...
Hey Data Guys, Show Us the Money!
I spent last week attending two separate events: the opening of the Center for Heterogeneous Integration and Performance Scaling (CHIPS)...
ASU’s School for the Future of Innovation in Society Creates Strong, Responsible Outcomes
Here’s a question I’ve been pondering ever since I started thinking about the Internet of Everything and what it means...
Trusted Data is at the Heart of Monetizing the IoT
While there’s been no end to the discussion of the benefits the Internet of Things will bring to our daily...
3D Stacking is Part of Life
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil...
Chasing the Fan-out Wafer Level Packaging Rabbit at IWLPC 2015
Sadly, this year it was the 3D session track that had lots of empty seats at the 2015 International Wafer...
Monolithic 3D Poses New Challenges for Test
At last week’s sixth annual IEEE 3D Test Workshop, it was exciting to see the number of presentations that demonstrated...
Congratulations, Kailash Raman, Winner of the 2015 3D InCites Awards Scholarship
I am consistently awed by the youth of today who are choosing to follow an educational and career path in...
Could Virtual SoCs built using FOWLP displace Interposers in Consumer Applications?
For quite some time on 3D InCites, we’ve talked about how breaking up SoC designs into specific functions not only...
SEMI Arizona Breakfast Forum Tackles the Tough IoT Questions
Lately, I’ve attended a good number of conference and symposium talks focused on the Internet of Things (IoT). Most of...
Novati’s Integrated Sensor Platform Brings It all Together
A few weeks ago, Tezzaron announced its latest industry first: an eight-layer 3D IC wafer stack containing active logic, built...
Executive Viewpoint: MEMS from Automotive to Consumer Electronics to IoT and Back
According to Eric Mounier, of Yole Développement, over the past 15 years, the MEMS market has grown from 15M units...
Is the IoT Headed for the Trough of Disillusionment?
No SEMI Summit would be complete without a lively panel discussion that puts industry experts in the hot seat. The panel...
2015 European MEMS Summit: Are we Living La Vida Loca or La Dolce Vida?
Last week, (September 18-19, 2015) SEMI Europe hosted its first-ever European MEMS Summit, in Milan Italy. It was a fitting...
With the Acquisition of Ziptronix, Tessera Takes the 3D IC Plunge
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas,...
Can 3D Super-NAND Improve Cost-per-Bit for 3D NAND?
The 3D NAND floodgates just opened a little wider with today’s announcement from BeSang that it has developed 3D Super-NAND...
