The Stacked Die Reality Check Continues; FPGAs Lead the 3D Charge
Oct 09, 2012 · By admin-impress · 3D In-Depth, Design, Devices, Manufacturing, Materials, Processes and Technology, Test and Inspection
3D Workshop organizers Erik Jan Marinissen (IMEC), Yann Guillou (ST-Ericsson) Geert Van der Plas (IMEC) report back from a...