The 2.5D & 3D Packaging Cost Model is the first tool available to model the total cost and yield from fabrication of the wafers to complete assembly. The user is able to edit a variety of parameters, including TSV and interposer characteristics and die preparation details, and generate a detailed cost breakdown.
Over the last few years, a number of foundries and OSATs have demonstrated the ability to fabricate and assemble 2.5D and 3D products. Unfortunately, high costs are currently keeping these technologies from being used in mainstream applications. However, as development continues, costs will drop and 2.5D and 3D will become cost-effective options for more products.
The 2.5D & 3D Packaging Cost Model will ensure that the right technology is selected for a product at the right time. The model provides guidance to product designers, allowing them to determine whether 2.5D or 3D technology is a cost-effective option for their specific products. It is also used for identifying cost and yield thresholds that must be met for 2.5D and 3D technologies to become competitive.
Many promising technologies have failed because they were used for the wrong application at the wrong time. This cost model was developed to prevent that from happening.