Telecommunication networks are undergoing a rapid transformation. With 5G rollouts, edge computing, and a surge in IoT devices, the pressure...
The convergence and synergy of performance and sustainability required to power the next generation of AI data centers The surging...
Henkel is proud to announce that it has won the Texas Instruments 2024 Supplier Excellence Award. The most prestigious level...
Henkel and Teca-Print today have announced a partnership in the pad printing field of printed electronics. The collaboration aims to...
Semiconductors are the micro-sized “brains” that power modern electronics, and the latest advancements in semiconductor packaging materials are transforming key...
Irvine, CA – Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements...
Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers...
Irvine, CA – Henkel today announced the addition of Loctite Ablestik ABP 8068TI to its growing portfolio of high thermal...
Irvine, CA – As integrated circuits (ICs) become more dense and complex, particularly in the power device sector, new approaches...
Henkel semiconductor packaging innovations earn Material Supplier of the Year Award Irvine, CA – Henkel today announced that it has...
Irvine, CA – Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications....
Irvine, CA – Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the...
This paper is co-authored by two of our member companies, Henkel Corporation and LPKF Laser & Electronics AG Laser Direct...
Highly-filled, fast-flow material balances reliability and processability, extends company’s package-level underfill leadership with multi-format solutions SEOUL, South Korea, Sept. 14,...
Investment to drive localized innovation and to strengthen collaboration with consumer electronics customers. Henkel has officially opened its South China...
Irvine, CA – Henkel today announced the opening of its Application Center in Santa Clara, CA designed to support product...
NCP and NCF Property Optimization Delivers High-Reliability Results Semiconductor package sizes are getting smaller and bump pitches narrower while the...
While critical to the processes, molding and encapsulation materials used in both fan-in and fan-out wafer-level packages (FI WLP/FO WLP) ...