November was a dynamic month for the 3D InCites community and the broader semiconductor industry, with companies showcasing innovative technologies, celebrating leadership achievements, expanding global operations, and advancing workforce development. From product launches and AI‑enhanced design platforms to award recognitions and strategic partnerships, industry leaders highlighted breakthroughs in advanced packaging, inspection, materials, logistics, and inclusive workforce initiatives that continue to shape the future of semiconductors.
Technology and Innovation
ASE announced the launch of IDE 2.0 — an AI-enhanced upgrade to its Integrated Design Ecosystem™, designed to significantly accelerate package design cycles, optimize chip-package interaction (CPI) analysis, and improve accuracy for complex AI and high-performance computing packaging applications. The platform leverages a cloud-based e-Simulator and AI engines to reportedly provide real-time design-analysis feedback across electrical, thermal, stress, and reliability domains, with the intentions of reducing what once took weeks to just hours (reportedly in some cases from a 14-day cycle to roughly 30 minutes).
Siemens highlighted the capabilities of its DigitalTwin solutions. The company noted that these tools enabled customers to simulate processes across design, production, and operation, helping transform complexity into competitive advantage, as emphasized by Tony Hemmelgarn, President and CEO of Digital Industries Software.
Nordson Electronics Solutions demonstrated its automated fluid‑dispensing and selective‑soldering systems at Productronica 2025, highlighting the SELECT® Synchro selective soldering system, which reportedly increased throughput by 20–40% using patent‑pending synchronous motion technology, along with ASYMTEK fluid‑dispensing platforms and high‑volume conformal coating systems. The company noted that the showcased equipment was designed for both printed circuit board assembly and advanced packaging, emphasizing its capability to handle single‑ and double‑sided boards, mixed‑technology assemblies, and small‑footprint, high‑throughput production
ACM Research delivered the industry’s first commercial horizontal panel electroplating tool, the Ultra ECP ap-p, to a panel‑fabrication customer, marking a milestone in the evolution of fan-out panel-level packaging (FOPLP) technology. The system reportedly supported pillar, bump, and redistribution‑layer plating on large panels — with performance comparable to traditional wafer processes.
ACM Research additionally delivered its first Ultra Lith BK photoresist‑hardening tool to a global display‑panel manufacturer, reporting that the system’s industry‑leading UV curing uniformity (±5 % UV intensity) and precision temperature control (±0.1 °C with six cold plates) significantly improved pattern fidelity, yield stability, and process repeatability in advanced lithography processes. The company noted that the tool’s flexible configuration — supporting line‑scan, rotary, and hybrid UV‑curing exposure modes — enabled adaptation to diverse lithography recipes
Collaborations
ERS electronic announced Symphony Engineering as its new channel partner for the Advanced Packaging Equipment Business Unit in Southeast Asia and India, noting that the partnership was introduced at the Electronics Packaging Technology Conference in Singapore, where representatives were available to discuss debonding optimization, warpage mitigation, and related advanced packaging solutions.
Circuits Integrated expanded into the UK by joining the Space South Central cluster, establishing a new R&D presence at Surrey Research Park, and began work on its next‑generation satellite and defence chipset platform, Kythrion™, intended for advanced antenna-in-package (AiP) and system-in-package (SiP) designs combining compound semiconductors (GaAs/GaN) with silicon. The company indicated that Kythrion aims to deliver substantial reductions (over 60%) in antenna size, weight, power consumption, and cost compared with conventional designs, and said early‑stage demonstrators are scheduled for late 2026, with broader availability expected by mid-2027.
LPKF became a founding participant in the newly formed Glass Panel Technology Group (GPTG), a consortium launched on October 1, 2025 under the leadership of Fraunhofer IZM that brings together 15 companies across the value chain to enable high-volume manufacturing of glass‑substrate based packaging. LPKF contributed its Laser Induced Deep Etching (LIDE) technology, which enables creation of Through Glass Vias (TGVs) and Redistribution Layers (RDL) on large glass panels — a key enabler for glass‑based advanced packaging targeted at next‑generation computing and AI applications.
Brewer Science and imec co‑presented technical papers at EPTC 2025 in Singapore describing breakthroughs in thin‑interposer assembly and flash‑lamp debonding. Their work reportedly demonstrated a sequential die‑to‑wafer (dD2W) bonding flow on thinned interposers using Brewer Science’s VersaLayer™ temporary bonding materials, including BrewerBOND® C1301‑50 and release layer T1107, followed by over‑molding and die reveal — an advance meant to support robust heterogeneous integration while controlling backside nano‑topography after thinning.
The company also collaborated with EV Group and Fraunhofer ASSID to co-present groundbreaking research on ultrathin wafer handling this week at WaferBond ’25 conference in Chemnitz, Germany. Fraunhofer ASSID led the presentation, demonstrating a process flow for handling 300-mm wafers thinned to 15 µm with the use of silicon carriers, BrewerBOND® high-temperature-stable adhesive, and EVG® IR laser debonding technology, addressing key challenges in mechanical stability, high-temperature compatibility, and stress-free wafer separation.
Expansion and Development
Kuehne+Nagel expanded its El Paso, Texas logistics facility by adding 20,252 m², increasing total capacity by 60 percent, to meet growing cross‑border logistics demand driven by sustained nearshoring trends. The expanded site, adjacent to the existing warehouse, featured 53 dock doors, 65 trailer spaces, vertical racked storage, and cross‑dock capabilities designed to support increased freight flow between the U.S. and Mexico, thereby reportedly reinforcing the company’s capacity to support resilient supply chains despite ongoing geopolitical and tariff uncertainty.
SurplusGLOBAL held a topping‑out ceremony on Building B of its Yongin Namsa Cluster, marking a structural milestone in the development of what is intended to become the world’s largest offline mall and storage facility for legacy semiconductor equipment and parts — the SemiMarket Parts Mall. The upcoming facility, covering approximately 41,000 square meters and slated for completion in July 2026, reportedly will operate in tandem with the company’s global online marketplace, enabling a hybrid online–offline ecosystem for the legacy semiconductor supply chain. SurplusGLOBAL stated that Building B is envisioned as a central hub for inspection, storage, refurbishment, and transactions of legacy equipment and parts, complemented by its Harvest Project for asset recovery and recycling, precision repair services, and AI‑based BOM matching and parts recommendation systems.
Awards and Recognition
ACM Research reported receiving the Global Technology Award in the Cleaning Equipment category for innovations in its Ultra C vac-p flux cleaning tool, an honor presented by Global SMT & Packaging during productronica. The company noted that CEO Dr. David Wang, Vice President of Sales Jim Straus, and Chief Technologist Sally Ann Henry accepted the award on its behalf, and stated that the recognition supports its continued work in advancing cleaning technology.
Evatec marked Semicon Europa with a presentation of a commemorative golden wafer to Françoise von Trapp of 3D InCites, recognizing her long-standing collaboration and industry partnership as she moves into retirement, and extending well-wishes for her next chapter.
Evatec additionally highlighted the recognition of Alexander Lutz with the SEMI 20 Under 30 Award, noting his progression from joining the company as a system engineer in 2021 to his current role as Manager Product Development. His early contributions, including automated testbench development and improvements to the Ship and Merge process that reduced lead times by up to 20 percent, were cited as key factors in his advancement, along with his management of cross-functional projects for power frontside applications and leadership of a team responsible for the CLUSTERLINE® 200 platform roadmap.
IMAPS highlighted Tim Going of StratEdge as the 2025 recipient of its Founders Award, recognizing his long-term leadership and contributions to the microelectronics packaging industry. Going, who has been involved with IMAPS and its predecessor ISHM for more than 35 years, described the honor as meaningful given the organization’s role in advancing semiconductor and electronic component packaging. The Founders Award is presented to an individual who established a company operating for at least ten years with 25 or more employees and active Corporate Member participation in IMAPS, acknowledging both technical and leadership impact within the community.
Saras Micro Devices announced that it was named one of Chandler, Arizona’s 100 Companies, a recognition highlighting organizations contributing to the city’s business community.
SEMI announced that its Spark Excellence Award, which recognizes leadership in advancing diversity, equity, and inclusion within the semiconductor ecosystem, was presented to Cassandra Melvin, Senior Director of Business Development and Operations. Established through the European Chips Diversity Alliance, the award honors individuals who promote representation, inclusion, and equitable opportunity across the industry, and SEMI noted that this year’s recognition reflects ongoing progress in strengthening inclusive leadership.
Indium Corporation announced that Senior Product Development Specialist Kevin Brennan and Marketing Communications Specialist Jordan Carroll received the SMTA Next Gen 10 Award at the 2025 SMTA International (SMTAI) for their exceptional leadership, innovation, and contributions to electronics manufacturing. The company highlighted Brennan’s role in driving advanced soldering solutions in collaboration with R&D and marketing teams, and Carroll’s contributions to global brand presence through oversight of trade shows, events, and marketing strategy; Carroll also supports professional development via her position as vice president of marketing for the SMTA Empire chapter.
Industry Events
Onto Innovation’s Melvin Lee presented Reducing Packaging Costs in Semiconductor Fabs through Predictive Testing Models at AEC/APC Symposium Asia in Fukuoka. His session outlined how the Discover® Yield AI platform helps manufacturers reportedly cut assembly test costs by identifying defective wafers early—helping to ensure only good wafers move on to dicing, packaging, and integration.
ACM Research reported an active week at SEMICON Europa 2025, noting extensive discussions on semiconductor technology and manufacturing under the event’s theme, Global Collaborations for European Economic Resilience, and highlighting its booth presentation focused on high-performance wet process capabilities.
Indium Corporation at productronica 2025 in Munich showcased several key technologies, including its Formic Acid Soldering Technology (FAST) for flux-free soldering applications, the Durafuse® family of solder alloys—HR, LT, and HT—engineered for high-reliability automotive and power device requirements, and its InFORMS® reinforced solder preforms for improved mechanical strength and bondline control. The company also featured its InFORCE® pressure sinter pastes for high-performance SiC die-attach.
Indium Corporation also announced that its Research Metallurgist, Dr. Huaguang Wang, delivered a presentation at EPTC 2025 in Singapore focused on reliability challenges in AI and high-performance computing (HPC) applications — specifically addressing large BGA assemblies. The company highlighted that its Durafuse® LT soldering solution is positioned to enhance sustainability and durability for BGA packages exposed to thermal‑cycling stress and potential warpage, common reliability risks in AI server and HPC environments.
Brewer Science presented advanced-node patterning and wafer‑thinning materials at SEMICON Europa 2025, aimed at supporting energy‑efficient and cost‑effective semiconductor manufacturing for AI packaging and high-performance computing applications. The company reported that its PFAS‑free, high-performance materials facilitated next‑generation lithography and wafer-thinning processes while aligning with sustainability goals
LPKF reported strong engagement at productronica 2025, citing steady booth traffic and interest in several technologies, including the CuttingMaster 2246 premiere, LIDE for advanced packaging, and its collaboration with Fraunhofer IZM on “The Line,” a live SMT production demonstration that reportedly drew significant attention.
KLA announced its participation in the Materials Research Society Fall Meeting & Exhibit in Boston from November 30 to December 5, noting that Bryan Crawford will speak in the Exhibitor Forum on December 3 regarding material response at high strain rates, and directing attendees to Booth 601 as well as to a recently released application note on fracture toughness measurement.
Evatec participated in the IMAPS Italy Workshop on Photonic Packaging in Milan on November 4–5, noting Italy’s growing role as a center for photonic packaging innovation. The company reported that Ewald Strolz, Senior Manager Process Development & Application Engineering, presented and addressed thin-film deposition developments for co-packed optics as a next stage in heterogeneous integration, including RDL seed layer and BSM stack deposition for AI devices, panel-level packaging considerations, and thermal management demands in high-performance computing applications.
Koh Young Technology highlighted its True 3D inspection portfolio at SEMICON Japan 2025 in Tokyo Big Sight, presenting both the Meister D+ and ZenStar systems to support advanced packaging inspection for high‑density substrates and mirror‑like die surfaces. The company indicated that Meister D+ delivered high-precision defect detection — including micro‑cracks, chipping, foreign particles, and other critical flaws — via advanced 3D optical and AI‑driven analysis, while ZenStar addressed wafer‑level and substrate‑level packaging inspection needs with robust 2D/3D multimodal defect detection. Koh Young emphasized that these solutions were intended to stabilize yield and process reliability even as packaging complexity and miniaturization increased.
Workforce Development
Siemens Digital Industries Software reported continued progress within its Siemens Startup Program, highlighting Real Life Robotics and its Passenger platform, which provides a hardware-agnostic command system for robotic and IoT operations; the company noted that support from partner Maya HTT has enabled both technical integration and co-marketing opportunities, including a recent conference presentation.
Amkor Technology reported its support for the Fresh Start Women’s Foundation as the organization launched its first Introduction to Semiconductors Cohort, which serves as an early step toward a pre-apprenticeship pathway intended to prepare women for Registered Apprenticeships and careers in semiconductors and advanced manufacturing. The company noted that Scott Holman, Vice President of Human Resources at Amkor Technology Arizona, Inc., welcomed participants and provided industry context, emphasizing the role such programs play in expanding access to high-tech opportunities and strengthening workforce diversity.
SEMI applauded the introduction of the new bill to extend the U.S. tax credit for semiconductor‑manufacturing suppliers through 2031, citing the proposed extension of the Advanced Manufacturing Investment Tax Credit (Section 48D) and the expansion of eligibility to critical‑materials suppliers as essential to strengthening the domestic semiconductor supply chain. The association emphasized that sustained investment across the entire supply chain was required to support growth in sectors such as AI, telecommunications, and bioengineering.
Career Advancements and Opportunities
Koh Young Technology named Jeff Lee as Head of Industrial Solutions Business, entrusting him with global sales, product planning, technical support, and oversight of the company’s worldwide branch offices — a structure aligned with strategic aims to balance innovation and customer-focused growth. With the company since 2002, Lee brings deep experience spanning R&D, product planning, and international sales; over the years he reportedly helped advance Koh Young’s optical inspection technologies, guided product strategies to address evolving manufacturing challenges, and strengthened global customer relationships.
Evatec is hiring for a Managing Director for Germany and Europe. Learn more here.
Trymax is hiring for various positions in the Netherlands including: Software Intern, Technical Buyer, Supply Chain Intern, Sr. System Integration Engineer, Process Intern, and Mechanical Design Engineer. Learn more here.
Brewer Science is hiring an HVACR Temp. Learn more here.
Amkor Technology is hiring for a Staff Engineer SAP Security in Tempe, AZ. Learn more here.
