Archives November 2013 - 3D InCites

Introducing the 3D InCites Technical Advisory Board

Introducing the 3D InCites Technical Advisory Board

Ever since 3D InCites was first launched in 2009, it has had an official technical advisory board of 2.5D and 3D integration experts whose job it is to offer guidance and support, mostly “behind the scenes”, and occasionally participate in online forum discussions. The original board was made up of mostly representatives from research institutes and a few from manufacturing (Sitaram Arkulgud f... »

Successful 2.5D Test Vehicle Project Launched by GLOBALFOUNDRIES, Open-Silicon and Amkor Technology

Successful 2.5D Test Vehicle Project Launched by GLOBALFOUNDRIES, Open-Silicon and Amkor Technology

GLOBALFOUNDRIES has unveiled details of a 2.5D test vehicle project that demonstrates the value of its open and collaborative approach to delivering next-generation chip packaging technologies. The company, in partnership with Open-Silicon (chief architect) and Amkor Technology, Inc. (assembly and test), jointly exhibited a functional system-on-chip (SoC) solution featuring two 28nm logic chips, w... »

Part 3: 3D NAND Flash – Towering Spires or Costly Canyons?

Part 3: 3D NAND Flash – Towering Spires or Costly Canyons?

As promised in Part 2 of this series, in this third installment, I’ll continue to wade into the choppy waters of string current. This is of such importance in any NAND Flash, and especially in the vertical channel 3D NAND Flash approach championed by Samsung and Toshiba that I’ll spend some time describing what it is. Now there is a small coterie that knows everything about this subject, but t... »

glass Interposer

GIT 2013: One Silicon Guy’s Perspective

A 3D conference (or 2.5D workshop) wouldn’t be a 3D conference (or 2.5D workshop) without someone announcing the push-out of the technology introduction another year or two. This is precisely what Phil ‘the Guru’ Garrou did with his market analysis talk at this year’s Global Interposer Technology Workshop (GIT 2013), which I attended last week at Georgia Tech University. Garrou listed ... »

Notes from GIT 2013

Notes from GIT 2013

The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013. Over 200 people from 11 countries attended this in-depth and lively discussion about interposers. Although many people think the conference is focused on glass (Glass Interposer Technology – another use of the GIT acronym) there was ample time given to sil... »

SemiSisters

SemiSisters: Factoring in the X

This blog post has nothing to do with 3D technologies. But since I run this website and the Françoisein3D blog, and it’s Friday before Thanksgiving, I’m taking the liberty of writing about something else for a change. I’ve been talking about it for years. Those of you in the semiconductor industry who know me well (both men and women!) know that SemiSisters was unofficially formed during di... »

Rudolph Wins Multiple Orders for AWX FSI Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications

Rudolph Wins Multiple Orders for AWX FSI Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications

Rudolph Technologies, Inc. announced that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory manufacturer. In both cases, the systems were selected after direct comparison with entrenched competitors. The AWX FSI unpatterned wafer inspection system is specifically designe... »

Polymer filled TSVs, Courtesy of EV Group

Polymer Filled TSVs: Solving the Cu Stress Issue

I’ve been on a quest to find out more about EV Group’s new polymer filled TSVs since they first announced it in September. According to a company press release, NanoFill™ process is said to provide “void-free via filling of very deep trenches and high-aspect ratio (HAR) structures, and is suitable for all common polymeric dielectrics—offering a highly flexible, low-cost and production-re... »

SUSS MicroTec Brings 3D IC Laser Debonding to Fraunhofer IZM

SUSS MicroTec Brings 3D IC Laser Debonding to Fraunhofer IZM

SUSS MicroTec announced the installation of its ELP300 excimer laser stepper to support next-generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. The ELP300 excimer laser platform is designed for high volume manufacturing (HVM) and processing of 100mm to 300mm wafers. The platform provides two novel man... »

Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVs

Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVs

Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D and 3D packaging technologies are changing the requirements for manufacturing tools in the back-end, and in many cases the back-end tools of today are starting to resemble the front-end tools of yesterday. Unfortunately, these tools are still expected to come at back-end tool... »

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