wafer dicing

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for emerging applications, such as Internet of Things (IoT) sensors, MEMS, RFID, CMOS image sensors and thinned memories. This advanced solution, which incorporates the EVG®100 series of resist processin... »

Rudolph Technologies and DISCO Corporation  Partner to Improve Wafer Saw Process

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. These comprehensive solutions will enable their customers to consistently improve the quality and productivity of their advanced packaging products... »