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August Member News: Pivotal Shifts in Leadership, Investments and Innovation
The month of August held pivotal shifts in the semiconductor industry, marked by leadership transitions, targeted investments, and continued innovation...
July Member News: Bold Investments and Strategic Acquisitions
July marked a dynamic period for our community members, characterized by bold investments, strategic acquisitions, and advancements in AI-driven design...
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
Heterogenous Integration at ISS: A Key Part of High-Performance Compute
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the...
SEMICON Korea 2025 Member Preview: Lead the Edge
In its continued focus on AI and smart devices, SEMI’s theme for this SEMICON Korea 2025 is “Lead the Edge”. ...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
October 2024 Member News
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
SEMICON Taiwan 2024 “Breaking Limits” Member Preview
Taking place from September 3-6, SEMICON Taiwan 2024 is just around the corner. With this year’s theme, Breaking Limits: Powering...
June Member News Highlights Semiconductor Design Tools, Collaborations, and More
This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing...
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
March Member Highlights: Anniversaries, Events, Collaborations, New Products, and More
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance...
Expanded Semiconductor Assembly and Test Facility Database Tracks OSATs and IDMS in 670 Facilities
SEMI and TechSearch International collaborate on a new edition of database tracking 33% more facilities and highlights advanced packaging and...
IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
SEMICON Taiwan – Community Member Preview
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its...
IFTLE 564: IMAPS Reshoring Conference Part 1: Focus on Chiplets
The week of July 10th IMAPS held its now annual reshoring conference jointly with the IPC. The General Chair of...
CHIPcon Community Member Preview
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
SEMI 3D & Systems Summit Community Member Preview
SEMI 3D & Systems Summit to Spotlight Latest Trends in Heterogeneous Integration, Hybrid Bonding, Chiplet Design and Photonics Leading experts...
