Latest Posts - Page 3
ECTC 2021 Features the Hottest Topics and Trends in Microelectronics
For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1,...
DPC 2021 Online Event Stacked with Community Members Leading Speaker Sessions
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...TechSearch International Analyzes Substrate Shortages and Explores Potential Solutions
Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate...TechSearch International Quantifies Heterogeneous Integration Market Growth
The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost...
Closing Out 2020 at the MEPTEC Holiday Hangout
After nine months of Zooming into all the virtual events, I can’t wait for things to go live again. In...
What I’m Thankful for This Thanksgiving
2020 has been a year for the books. Honestly, between the divisiveness in the USA caused by this year’s election...
3D InCites Community Members Pack the Virtual IWLPC Exhibitor Hall and Technical Program
Virtual IWLPC kicks off on October 13, 2020, and 3D InCites community members will be well represented, from the panel...
Why We Need to Address Known Good Die (KDG) Holistically
If you love, like me, to work on the bleeding edge of technology, you will find that your personal success...TechSearch International Projects Growth in FO-WLP Market
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is...
TechSearch Presentation Highlights Key Developments in Advanced Packaging
In a recent MEPTEC / iMAPS webinar, Jan Vardaman, President, and Founder of TechSearch International presented growth drivers for advanced packaging...
MEPTEC’s Annual IC Packaging Industry Update
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President...
TechSearch International Analyzes Trends in FO-WLP including Panel Activity
While Apple remains the main customer for TSMC’s Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a...
SEMICON West 2017: The Semiconductor Industry at a Young 50
The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over...
TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends
Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these...TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages...
TechSearch International Analysis Shows CSP Growth Remains Strong
Despite a slowing growth rate for smartphones, the industry is experiencing strong growth for CSP packages such as QFNs and...
First-Mover Advantage: Fan-Out Panel Level Packaging at IWLPC 2016
“It is better to be first than it is to be better.” (Ries and Trout, in The 22 Immutable Laws...
Discussing Panel Scale Packaging at SEMI’s Northeast Forum
SEMI did a great job at SEMICON West 2016 organizing a bursting-at-the-seams amount of technical content presented on the show...
