substrates

High-Performance IC Substrate Manufacturing Reaches an Inflection Point

High-Performance IC Substrate Manufacturing Reaches an Inflection Point

Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts are driving substrate layer counts to more than 20. Larger die sizes and multiple die mounted on the substrate are driving the need for larger body sizes, up to 100 mm x 100 mm. Some companies use a silicon interposer with multiple redistribution layers (R... »

Advanced Substrates: The Winds of Change

Advanced Substrates: The Winds of Change

Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation. However, in the past few years, things have changed. The dedicated landscape welcomed innovative solutions and new players. “Today, we are facing an increasingly competitive ecosystem and players are looking to differentiate from each other’s” asserts Ma... »

IFTLE 415:Substrate-like PCBs; Three Top Ten Packaging Houses are China-based

IFTLE 415:Substrate-like PCBs; Three Top Ten Packaging Houses are China-based

Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that of an IC substrate. The main difference between a PCB and an IC substrate is the feature sizes, especially line and space (L/S). SLP requires line width/line spacing equal to or less than 30/30 mm, which allows for reducing the size of the main board, thus making space for... »

CEA-Leti and SHINKO Sign Common-Lab Agreement

In a move that promises to provide increased performance and smaller size for portable electronics and other advanced systems, CEA-Leti has signed a multiyear agreement with SHINKO Electric Industries, Co. Ltd. (“SHINKO”) to develop advanced semiconductor packaging technology. The work, which will be part of Leti’s broader efforts in advanced silicon substrates, will focus on silicon interp... »