Latest Posts
Novel Semi-additive Process Streamlines RDL to Address Industry Roadmaps and Reduces Cost
The record attendance at ECTC a month ago in Dallas was just the latest indicator of the explosion of interest...
IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP
In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR...
Replacing NMP: Are You Ready?
NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an...
Advanced Packaging Trends – Part II: Solving Lithography Challenges
Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM)...
Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges
Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now...
Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions
“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging...
SPTS: Sigma fxP PVD with Multi-Wafer Degas
SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It...SUSS MicroTec launches RCD8: The new Resist Coat and Develop Platform
SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor and related markets, launched the RCD8, a new...
