RDL

Replacing NMP: Are You Ready?

Replacing NMP: Are You Ready?

NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an effective and versatile cleaning agent, removing photoresist residue while leaving the surface in good shape for processing steps downstream. However, its time may be short-lived as companies strive to meet environmental health and safet... »

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM) / redistribution layer (RDL) challenges. This article looks at AP trends from a lithography standpoint and proposes solutions to associated lithography challenges. The need for advanced packaging solutions is greater than ever as the world continues to demand increased... »

Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges

Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges

Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now transitioned to the packaging side as customers are shifting from wire bonding to flip chip for use in wafer level packaging (WLP). According to VLSI Research, about 35% of chips are currently packaged using WLP techniques. Advanced packaging opportunities slowe... »

Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions

Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions

“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing at Yole Développement (Yole). Indeed advanced substrates are critical in enabling future products and markets. To answer to technology evolution and market needs, Yole’s advanced packagi... »

SPTS: Sigma fxP PVD with Multi-Wafer Degas

SPTS: Sigma fxP PVD with Multi-Wafer Degas

SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throughputs, despite the outgassing challenges posed from the increasing use of organics, such as mold in Fan-Out WLP. Testimonial Fan-Out Wafer Level Packaging (FOWLP) technology is an increasingly popula... »

SUSS MicroTec launches RCD8: The new Resist Coat and Develop Platform

SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor and related markets, launched the RCD8, a new manual Resist Coat and Develop Platform for substrates. The new platform  is said to offer a high application variety coupled with low investment costs as well as an easy transfer of processes from the RCD8 manual platform to a SUSS MicroTec production tool. The RCD8 i... »