Latest Posts
July Member News: Bold Investments and Strategic Acquisitions
July marked a dynamic period for our community members, characterized by bold investments, strategic acquisitions, and advancements in AI-driven design...
IFTLE 620: Micross Acquires Integra; Hynix HBM booked through 2025
Micross, a portfolio company of Behrman Capital, announced on January 15, that it has acquired Integra Technologies, headquartered in Wichita,...
Announcing the Winners of the 2025 3D InCites Awards
As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
IFTLE 609: TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at IMAPS 2024
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
IFTLE 577: Amkor Announces US Packaging Facility; IBAS RESHAPE Winners Announced
Amkor Technology’s announcement to build a high-volume facility in the US, as well as the award winner announcements for the...
$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Melville, NY (November 27, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic products and services for aerospace,...
Community Member Conversations from IMAPS 2023
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
Community Member Monthly News – August 2023
News you may not have seen this month from our community members. Along with some upcoming participation to keep an...
IFTLE 567: IMAPS Onshoring Conference Reports U.S. OSAT Activities
Continuing our look at the IMAPS Onshoring conference with a look at U.S. OSAT activities. (We should note that while...
2023 ECTC Community Member Preview
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
Micross Acquires Technograph Microcircuits Ltd., Expands Portfolio of Packaging and Substrate Capabilities for Multi-Chip-Modules, ASICs and PCBs
Melville, NY (May 2, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for...
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
Micross to Acquire High-Reliability DC-DC Converter Business of Infineon Technologies AG
Acquisition Expands Micross’ High-Reliability Power Management Solution Capabilities Melville, NY – January 10, 2023 – Micross Components, Inc. (“Micross” or...
Community Member Monthly Highlights – September
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
What does the Passing of the CHIPS and Science Act Mean for Advanced Packaging?
I usually leave this sort of commentary to Phil Garrou and Dean Freeman. But after a year of debate and...
