fan-out wafer-level packaging

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer

It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the 2017 3D InCites Awards. The 2017 3D InCites Awards will be presented on Wednesday, July 12, 2017, during SEMICON West, in a ceremony at the Impress Lounge, (located above Moscone North). The ceremony will be followed immediately by a cocktail reception to benefit this year’s designate... »

Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!

Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!

Here we go again! One thing is for sure, there is never a dull moment at the IMAPS Device Packaging Conference panel sessions. (Remember the year of Alphabet Soup?) Maybe it’s because they take place AFTER everyone’s had a few drinks, but this year was especially lively and entertaining. There was humor, there was drama, AND there was a really good story being told at the fan-out panel discus... »

Panel Level Packaging: One Size Fits All?

Panel Level Packaging: One Size Fits All?

There is an active and robust supply chain currently supporting these wafer sizes in the semiconductor manufacturing industry: 3”; 4”; 6”; 200mm; 300mm; and 330mm. This wide range of substrates is successfully being used today for “sweet-spot’ manufacturing of LED, compound semiconductor, MEMS, trailing-edge CMOS, leading-edge CMOS, and fan-out wafer level packaging (FOWLP) applications,... »

Addressing Advanced Packaging Challenges in 2017 and Beyond

Addressing Advanced Packaging Challenges in 2017 and Beyond

As the two-dimensional (2D) shrinking of planar circuits (on which Gordon Moore based his famous observation) has become more difficult and expensive, the semiconductor industry has had to find other ways to continue to put more computing power and speed into less volume. At the same time, consumers are demanding greater functionality that integrates a variety of interconnected circuit types. The ... »

Pasadena offers Roses and Technology

Pasadena offers Roses and Technology

California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It takes commitment and organizational talent to make these events successful for 100+ years, and encourage every contributor to prepare and execute successful events every year. Last week’s International Microelectronics Assembly and Packaging Solutions Conference (iMAPS) in Pasadena’s Con... »

Gartner: New Normal is Slow Growth, Plentiful FOWLP

Gartner: New Normal is Slow Growth, Plentiful FOWLP

What is the “new normal” for semiconductors? Jim Walker, Research VP, Semiconductor Manufacturing, Gartner, closed out Q3 2016 with his informative talk at the IMAPS | MEPTEC | SEMI Northern California Chapter luncheon meeting on September 28, 2016, at SEMI HQ in San Jose, California, addressing the topic of the “New Normal” for Semiconductors. Remember diagraming P.E.S.T analyses ... »

Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package

Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package

There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP) as the entire semiconductor industry turns to advanced wafer level packaging and system-in-package solutions to take the world to its next generation of connectivity, in which our smartphones drive our lives, and the Internet of Things becomes a reality. While lithography is often thought of as ... »

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes Wilmington, Mass. (September 6, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today launched two new inspection and metrology solutions for advanced semiconductor manufacturing: the Firefly™ System for high-r... »

Will Fan-out Packaging be Sustainable Long-term?

Will Fan-out Packaging be Sustainable Long-term?

2016 is a turning point for the Fan-Out packaging market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of fan-out packages. Yole Développement (Yole) is analyzing the current market and technologies trends and offers you to discover these results within a new report entitled Fan-Out: Technologies & Market Trends 2016. TSMC investment in fan-out wafer... »