Latest Posts
Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…
Despite a valiant effort by the ECTC committee to integrate design topics into this year’s agenda, the number of empty...
SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and...
Mentor Graphics: Xpedition Package Integrator
Xpedition® Package Integrator provides a holistic co-design methodology that automates planning and optimization of connectivity from a chip through multiple...
SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology Cool
From March 16-20 the annual SEMI-THERM Conference (SEMI-THERM 2015) in San Jose gave me the opportunity to meet many assembly, materials,...
3D By Design: Are Path Finding Tools the Missing Link?
TechSearch International’s recently published 3D IC Gap Analysis report has a section for a new class of tools called Path...
Breaking Down Walls between Board, Package, and IC Design Steps
Many years ago, when I started in the semiconductor business, the circuit designers only had to worry about functionality and,...
