Latest Posts - Page 3
3D Company Updates
There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw...3D TSVs: Will Europe Lead the Way?
The first European 3D TSV Summit (January 22-23, 2013) hasn’t even happened yet, and already its intended message is becoming...“Known Good Die” has a new name
After 20 years of chasing elusive Known Good Die (KGD) to achieve high yielding advanced interconnect technologies, the semiconductor industry...Coffee Break with Nicolas Sillon, CEA Leti
The day after Nicolas Sillon presented his keynote at IWLPC on interposer technology, we sat down to coffee and a...Catching up with imec’s Eric Beyne
Eric Beyne (imec) and I go way back. He’s the Scientific Director of Advanced Packaging Technologies at imec, and ever...STATS ChipPAC Advances TSV Capabilities; Qualifies 300mm MEOL and Low Volume Manufacturing
Outsourced Semiconductor Assembly and Test (OSAT) provider, STATS ChipPAC Ltd., has announced qualification of its 300mm middle-end-of-line (MEOL) manufacturing operation for...The Flip Side of the Glass Interposer Coin
We’ve been hearing and reading a lot about work being done at Georgia Tech’s PRC in developing glass interposer technologies...June Event Highlights in 3D
Note to self: no more graduations/college orientations/vacations in the month of June. There are way too many events in 3D...The Psychology of 3D Integration
Long before he set out on the 3D Holy Grail, Herb Reiter had other pursuits that involved bringing new technologies...
