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One of the ways to build more complex, powerful, and cost-effective electronic systems is stacking chips on top of each other. Imec recently compared the two main options for going 3D: interposer-based stacking and 3D stacking. The goal of the exercise was to detect whether the stacking and packaging processes...
While most of the research institutes in the US and Asia have been focused on commercializing 3D integration technologies for mass markets such as mobile devices and consumer electronics, one US-based research institute has followed a different path more similar to that of the European research centers; focusing its 3D...
49 years ago, Solid State Equipment, LLC (SSEC) opened its doors with its first piece of semiconductor equipment; a seam sealer for welding the lid on hermetic packages. Today, that tool still exists, and although it now accounts for 1% of SSEC’s revenue instead of 50%, sales have remained constant...
A 3D InCites reader recently inquired whether cost drivers and fine-pitch requirements in 3D applications are moving manufacturers away from flux towards fluxless processes in the bumping steps for both bump formation and assembly.To answer this question, 3D InCites turned to the materials and equipment experts, speaking with Jeff Calvert,...
Semicon Taiwan, Taipei, September 4, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications. Available on the EVG100 series of resist processing systems, the new...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known in the 3D IC world for its high accuracy die bonder for die-to-die and die-to-wafer stacking. The SET Representative in North America (SETNA) has also launched a companion tool, ONTOS7,...
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on ensuring that all pieces of the 3D IC puzzle are in place. This was evident from the range of presenters they had lined up during this year’s Technology Forum, held...
Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric ambient prior to bonding. Proven effective on many elemental metals and their alloys, this tool cleans and passivates bonding surfaces rapidly and safely without damaging critical layers. Testimonial To achieve high-density...
At ECTC 2013, Dow Corning Corporation (DCC) introduced its solution to the temporary bond/debond conundrum. During the materials and process session, Ranjith John, materials development & integration engineer at Dow Corning, presented a paper titled Low Cost, Room Temperature Debondable Spin on Temporary Bonding Solution: A Key Enabler for 2.5D/3D...
Almost a year ago, Dave Kirsch took over the reins from Steve Dwyer as VP and General Manager of EV Group North America. Since EV Group launched a tool last week at SEMICON Singapore, and since EVG NA’s headquarters are practically in 3D InCites’ back yard, I thought it was...
