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SUSS MicroTec and BRIDG to Establish a Production-Level Applications Center in North America

Dec 03, 2019

SUSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, announced today a far-reaching collaboration agreement with BRIDG, a not-for-profit, public-private partnership focused on production process technologies, advanced system integration, and 200mm microelectronics fabrication advancing next-generation nanoscale technology. This partnership puts an unprecedented array of SUSS MicroTec...

SEMICON Europa and Productronica 2019 Exhibitor Showcase

Nov 25, 2019

The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade between front-end processes, advanced packaging, and board assembly, getting the whole story called for visits to the...

IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP

Feb 14, 2019

In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR – 1µm RDL Ultratech, IMEC and JSR discussed “One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material”. This study compared the creation of 1.0μm RDL...

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

Jan 02, 2019

The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions...

Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge

Aug 29, 2018

Throughout my years of writing about the semiconductor industry, I’ve met women from all over the world. I’ve often wondered what or who encouraged them to pursue careers in this male-centric environment? How much of their motivation is inspired by the culture of where they grew up? Can success be...

MRSI Targets MRSI-H3LD Die Bonder For The High Power Diode Laser Market

Aug 29, 2018

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as industrial lasers, optical fiber amplification, lighting, and sensors. High power diode lasers are critical components for multiple...

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

Mar 07, 2018

North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our new MRSI-HVM3 die bonder system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy worldwide customer...

MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE

Aug 28, 2017

North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the 19th China International Optoelectronics Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our Chinese Representative CYCAD Century Science and Technology...

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

Jul 14, 2016

FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 automated metrology system. Designed to support the increasingly stringent manufacturing requirements for advanced packaging, MEMS and photonics applications, the EVG50 performs high-resolution non-destructive...

Samsung 3D Stacked DDR4 DRAM Brings Via-Mid Technology to the Mainstream

Aug 06, 2015

LYON, France – July 31, 2015 – System Plus Consulting, sister company of Yole Développement (Yole), released its new reverse costing report, Samsung 3D TSV stacked DDR4 DRAM. In August 2014 Samsung announced the mass production of the first analyzed 3D TSV technology based DDR4 modules for enterprise servers. According...