MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE

MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE

MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the 19th China International Optoelectronics Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 6-9, 2017.  This year 3,000 exhibitors and 60,000 professionals are expected to attend including world leading optoelectronic manufacturers to showcase their latest products and technologies. MRSI Systems will be offering private demonstrations of our new product MRSI-HVM3. We will demonstrate the MRSI-HVM3 completing chip-on-carrier (CoC) eutectic and epoxy bonding. Please contact MRSI, if you are attending the show, to ensure you have an opportunity to see the capabilities of this exciting new product.

MRSI Systems offers a new 3μm die bonder for high volume manufacturing of photonic, sensor, and semiconductor devices. The system delivers industry leading speed without sacrificing high precision and superior flexibility by incorporating MRSI’s latest hardware and software innovations.  These benefit customers with best-in-class throughput for capacity expansion, high accuracy for advanced high-density product packaging, and unmatched flexibility for multi-chip production in one machine.

For over 33 years, MRSI Systems has been a strong advocate for developing laser technologies and expanding laser applications for new markets. This year we are pleased to sponsor “The 1st Executive Forum on Laser Technologies” September 6-7, 2017 during CIOE. We are looking forward to discussing, with worldwide industrial and academic leaders, new laser technologies and applications in communications, sensors, industrial and other emerging areas. Learn more about the forum.

About MRSI Systems
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production, and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. We are headquartered in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Malaysia, the Philippines, Israel, the Netherlands, Switzerland, and the United States.

For more information visit: www.mrsisystems.com.

MRSI Systems Media Contact
+1 (978) 667-9449
marketing@mrsisystems.com