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Investors include Onto Innovation, Lam Capital, UMC Capital, and MediaTek Capital Multibeam Corp. announced that it has raised $31 million in Series B funds from global investors led by Onto Innovation Inc., a leader in process control solutions for advanced nodes and advanced packaging, and Lam Capital, the venture capital arm...
SAN JOSE, Calif.—July 10, 2024—Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and media technology sectors to market, was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on...
As the company boasts some of the most advanced plasma equipment in the industry, CCO Peter Dijkstra discusses how Trymax Semiconductor Equipment B.V. (Trymax) has achieved this unique position. Amongst many titans of the semiconductor manufacturing industry in the Netherlands, Trymax Semiconductor Equipment B.V. (Trymax) is the company of choice...
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st consecutive year listed among “THE BEST” suppliers ST. FLORIAN, Austria, June 27, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and...
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications Kalispell, Mont. – June 2, 2022 – ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it is...
Melville, NY (July 1, 2021) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications, today announced the acquisition of Semi Dice, LLC (“Semi Dice”), a global provider of high-reliability die & wafer products and value-added services. The...
Last week our awesome and hardworking R&D-team managed to demonstrate CNF-growth on a 200mm silicon wafer in the Chalmers MC2 150mm lab in Gothenburg. This great achievement opens up new methods for better and simpler prototype manufacturing for customers utilizing 200mm production processes.
SPTS Technologies has launched its low temperature plasma-enhanced chemical vapor deposition (PECVD) solution for via-reveal passivation in 3D-IC packaging applications. Already proven in 300mm volume production fabs, the Delta fxP® PECVD system deposits dielectric layers onto bonded substrates at wafer temperatures below 200°C, with throughputs up to twice that of...
This week’s webinar on chip stack assembly simulation, presented by Kamal Karimanal of Cielution offered some useful information on how modeling can be used to minimize warpage in 3D stacking. In 3D stacking, versus traditional flip chip processes, thickness of RDL layers in comparison with the thinned die or wafer can lead...
SEMI announced today the formation of a Three-Dimensional Stacked Integrated Circuits (3DS-IC) Standards Committee. 3DS-ICs are composed of a stack of two-dimensional die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current integration methods like wirebond and flip chip have been in production...
