Matches for your search: "fan-out wafer level packaging "
For decades, chemical mechanical planarization (CMP) has been one of the enabling technologies of semiconductor manufacturing. Without ultra-flat and uniform surfaces, today’s microprocessors, memories, and high-density interconnects would not exist. But as the electronics industry pushes beyond wafer-centric paradigms toward panel-level packaging, advanced substrates, and heterogeneous integration, conventional CMP concepts...
Recently, I worked on a grant proposal for the International Microelectronics and Packaging Society (IMAPS) Academy, as part of the Department of Commerce’s National Semiconductor Technology Center’s (NIST) workforce development initiative. Through this project, I experienced the semiconductor industry on a personal, first-hand level, working closely with IMAPS staff and...
The university setting offers a valuable environment for future engineers to explore and learn about technologies that will become part of their daily lives when transitioning from school to a career. At the same time, universities working on microelectronics and advanced R&D are increasingly looking for more advanced manufacturing equipment...
The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product introductions, events, job openings, and more. Here’s a collection of February member highlights. Acquisitions, Partnerships and Collaborations ASE announced a strategic partnership with Infineon Technologies, to acquire two back-end manufacturing...
In 1965 Gordon Moore proclaimed that there would be a “’Day of Reckoning’ when it may prove to be more economical to build large systems out of smaller functions…”. The 2022 IEEE International Test Conference, held live and in-person for the first time since the pandemic, addressed the implications of...
HALF MOON BAY, Calif. — April 5, 2022 — SEMI Industry Strategy Symposium (ISS) 2022 opened yesterday with the theme Semiconductors Leading a Transforming World to highlight semiconductor industry growth opportunities and challenges. The annual three-day conference of C-level and senior industry executives gives a comprehensive outlook of global electronics...
Really, it all boils down to simple economics. I’m referring to WHY the road to 3D is taking as long as it is to reach commercialization. We’ve convinced the engineers of the technology benefits. Now it’s time to convince those who hold the purse strings: the management. I had an...
Last week I attended SEMICO’s Research Summit, in Scottsdale, AZ, and was fortunate to hear some high-level industry executives discuss the emerging landscape of the semiconductor industry, and 3D integration’s role in it. What was most interesting was the resounding call across the board for collaboration across the supply chain,...
NEXX Systems' 10th Anniversary celebration dawned sunny, warm and dry, a rare occurrence these days in the Northeast. In fact, the company was taking quite a risk to plan an outdoor celebration, regardless of the tent. But that pretty much describes the company’s overall approach to business, and why they’ve...
Take note everyone in charge of event planning: Léti really upped the ante last night at their Annual Research Reviews Gala event, held outside of Grenoble at the lovely Hotel Chavant. While attendees sipped wine and socialized on the outdoor terrace under a green canopy of Chestnut trees adorned with...
