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MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to have received the 3D InCites Technology Enablement Award for its latest advanced packaging solution, the NOVAFAB® Fine Grain Copper electroplating process. Recognized by one of the industry’s most respected platforms in...
JOINT3 is a co-creation evaluation platform established by Resonac Corporation with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies. JOINT3 brings together global leaders in semiconductor materials, equipment, and design. Using a prototype...
COP 27 was held in the second and third week of November 2022. In the media, there was news of calls to accountability for promises made at COP 26, for which richer nations are still lagging. These included a $100 billion fund to assist smaller countries that are significantly impacted...
Addressing sustainability issues is a hot topic in the semiconductor industry, especially since Bloomberg highlighted that the industry’s carbon footprint is growing at a rapid clip while the auto industry’s carbon footprint has declined over the same period. However, the article only calls out GM as the automaker of reference....
Francoise will be presenting A Sustainable Future Requires Heterogeneous Integration at MicroTech 2021, the Annual IMAPS-UK Conference. Session 5 at 3:15pm Abstract: In September 2015, 193 member states of the UN adopted 17 new sustainable development goals (SDGs) to make our world more prosperous, inclusive, sustainable, and resilient. As a...
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important. No longer can the industry count on monolithic integration to achieve the economic gains of the previous era. New packaging solutions are being adopted to achieve the economic advantages that...
I always hesitate to cove 3D transistors, because before they came along, I only focused on what I knew to be 3D – ie: 3D stacked packages, 2.5D interposers and 3D ICs. And that was confusing enough. But then along came Intel’s Tri-Gate technology, claiming the 3D moniker as its...
Wow, times have changed. Who would have thought the foundries would ever willingly turn to the packaging industry for the solutions to future scaling? But I heard it myself yesterday at the ECTC luncheon keynote address, straight from the lips of Global Foundries’ CTO Greg Bartlett, who said that “silicon is not a...
One of the main themes of last week’s MEMS Executive Congress was to “think outside the chip” (Roger Grace, of Roger Grace Associates) and rather, think of MEMS in terms of the system. However, to do that, there needs to be interaction between everyone involved in developing said system, including...
French research insitute, CEA-Leti and Docea Power, developers of software for power and thermal analysis at the architectural level, have entered into a common lab agreement to combine their expertise in 3D silicon integration and thermal and low-power design.
