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SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications

Jul 09, 2014

One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that HuaTian Technologies (Kunshan) Co., Ltd. has selected an SPTS Sigma fxP...

Time to Cast Your Votes for the 2014 3D InCites Awards!

Jun 23, 2014

The nominations are officially closed for the 2014 3D InCites Awards; and now comes the fun part. This year, while the industry expert judges  will determine the winners of each individual category; one Reader’s Choice Award will be decided by you; the registered members of the 3D InCites Community through an Online...

AMD’s Bryan Black to Deliver 2014 3D InCites Awards Breakfast Keynote

May 12, 2014

Panel of judges expanded and Reader’s Choice Award added PHOENIX – May 12, 2014 – 3D InCites, the premier online content source for reliable 3D technology information, today announced that Bryan Black, Senior Fellow at AMD, will present this year’s keynote speech at the 2014 3D InCites Awards Breakfast. Co-hosted...

IME's Silicon Photonics

Si Photonics: 3D ASIP’s Pre-game Show

Dec 13, 2013

Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story told during an R&D panel at SEMICON West, it’s not exactly accurate. At this week’s 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) which took place Wednesday, December 11, 2013...

Multitest: Handling the Mobility Market

Jul 31, 2013

What better way to wrap up a busy week at SEMICON West 2013 than a site visit? After three days of interviews and PowerPoints, I was ready for some some hands-on demonstration. Barbara Loferer, marketing manager of Multitest, was concluding an open-house week at the company’s San Jose facility to promote...

FormFactor Tackles Probe Test for 3D ICs

Jul 24, 2013

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long time, the jury was out on the probe-ability of micro-bumped TSV wafers. The jury was also unsure whether or not there was any point to probing to ensure known good...

Figure 1: Electrografting provides a very strong adhesion between organics and any surface

Alchimer Streamlines Wet Approach

Jul 22, 2013

Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development and technology, Alchimer, about recent developments to further optimize the companies’ electrografting processes for through silicon via (TSV), isolation, barrier, seed and fill steps. I wrote about them frequently in...

SETNA: Atmospheric Plasma Surface Modification

Jul 22, 2013

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known in the 3D IC world for its high accuracy die bonder for die-to-die and die-to-wafer stacking. The SET Representative in North America (SETNA) has also launched a companion tool, ONTOS7,...

Figure 2: Shows the photo of a 50 μm thin wafer after debond on a tape.

Dow Corning offers the Power of Silicone Technology

Jul 22, 2013

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in...