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This week we continue our look presentations from SEMICON Europa’s Advanced Packaging Conference. Intel’s Reliability Test Beth Keser’s group at Intel Germany discussed their “product-on-board” reliability test for 0.3mm WLCSPs. The existing JEDEC/IPC board-level methodology tests are fine for traditional packaging solutions for non-extreme low K dielectric (ELK) fab nodes....
“Changes in the semiconductor supply chain and shifting business models, as well as uncertainty related to US-china trade, creates a growing number of huge opportunities for some while posing a threat to others,” comments Emilie Jolivet, Division Director, Semiconductor & Software at Yole Développement (Yole). “At Yole, we are continuously...
Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density, and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have...
“Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established in low-end and high-end applications”, asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “It has proven benefits in terms of form factor with no IC substrates, performances...
The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the industry to rely on integrated circuit (IC) packaging to extend the benefits of the More-than-Moore era. Thus, the advanced packaging industry has entered its most successful period, boosted by widespread...
Out of the top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China, US, and Malaysia. The leading giant of the outsourced semiconductor and test service providers (OSATs), ASE Technology Holding Co., Ltd. (formerly ASE Inc.) and subsidiaries, has got even bigger after...
