Matches for your search: "SEMICON West"
It’s official. Die stacking and interposer integration have been implemented in a high volume consumer application. AMD officially launched the Fiji GPU processor, the first to feature die stacking and high bandwidth (HBM) technology, amidst quite a bit of media fanfare at the E3 gaming conference in Los Angeles and...
For the third consecutive year, 3D integration enthusiasts gathered at the Impress Lounge at SEMICON West for the 2015 3D InCites Awards Breakfast, sponsored by Micron, to celebrate innovation in 3D integration and honor those who have contributed significantly to the advancement of innovative processes that enable interposer integration, 3D...
The journey to the commercialization of 3D integration technologies has been long – longer than most expected – an arduous. It has required tremendous investment, and it has required the efforts of the entire supply chain. The industry has experienced a paradigm shift in how it conducts business because of...
Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced Scott Jones, director, Alix Partners, will deliver a keynote address titled How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure at the third annual 3D...
In Part 1 of this series I drew your attention to what Peter Clarke, writing in EETimes on 02 January 2015, called the “15-in-15: Analog, MEMS and sensor startups to watch in 2015.” What would we find if we were to look for signs of heterointegration in this particular gathering,...
One thought lingers for me today from MEMS Executive Congress US 2014. I heard it said a few years ago, by Rob O’Reilly, a MEMS Industry Group Hall of Famer from ADI, and I heard it again from Peter Merz, whose company, X-FAB, was honored in an open voting process at...
I’m pretty sure the time I got to spend last week at the SEMI High Tech U Graduation ceremonies was the most fun I’ve had all year. The event was held at KLA Tencor in San Jose, CA, November 13, 2014, and I was invited to participate as a guest mock-interviewer, and also to present the...
Herb Reiter, eda2asic, presented this poster presentation titled “The Internet of Things and Semiconductor Test” at the Test Vision 2020 Workshop during Semicon West 2014. Here is the printed transcript of the talk. The accompanying slides referenced in the text can be downloaded as well. In the 1990s cell phones...
Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in high bandwidth memory and logic applications for mobile devices, but rather to be an enabler for heterogeneous integration of disparate technologies for everything from medical and automotive applications to industrial...
The winds of change are blowing in the semiconductor industry. And while some cling tightly to the way things have always been, it’s becoming more apparent that for those who can adapt, there are a multitude of opportunities, and for those who think it can stay the same, it will...
