Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
Visiting the Valley in 3D
Some people get excited when they go to Hollywood and see famous people. Not me. Today, I got positively giddy driving from from San Jose airport to both Invensas and Ultratech’s headquarters. Oh look! It’s SAMSUNG R&D CENTER! Toshiba! MICRON! I felt that I was in the presence of greatness....
3D Turns up at the BiTS Workshop 2012
It wasn’t on the final agenda, but thanks to a last-minute presentation switch by BiTS Workshop keynoter Jim Feldhan, president of Phoenix-based Semico Research, 3D became a featured topic at this year’s event. For the past few years, BiTS General Chair, Fred Taber, has contracted me to conduct video interviews...
GSA’s Silicon Summit: Good News from the 3D Ecosystem Panel
I don’t get to attend all the 3D events that I would like to, and such was the case with this year’s GSA Silicon Summit, held Thursday, April 26, in San Jose. But I did get some insight from Rich Rice, Senior VP of Sales and Engineering, ASE, who was...
Transparent, Flexible, Scalable 3D Memory –Could it Get any Better?
A few weeks ago, I came across an article on a new nanotechnology process in development at Rice University that can be used to build transparent, flexible 3D memory chips. According to the article, these chips could replace flash memory in thumb drives, smart phones and computers. The transparency also...
EDPS 3D Friday – The Vendor’s Turn
In addition to my Monday blog post, there has been a plethora of articles authored by other industry bloggers about the 3D Friday event, most of them focused on the user perspective, as well as the panel. I haven’t seen a whole lot of attention paid to the vendors, Mentor,...
Show Me The Money: 3D Friday at EDPS
While it was Good Friday for most, it was 3D Friday for those of us who attended the 19th Annual Electronic Design Process Symposium (EDPS), held last week in Monterey CA. What an amazing location! For an ocean-starved desert dweller like me, it was hard to tear my eyes off...
And Now, a Word for Our Sponsors
While there’s no denying that our registered members, guest bloggers, forum panelists, advisory board, and regular readers are all vital elements of the 3D InCites community, none of this would be possible without the financial input of our advertisers. So I would like to briefly take up some blog space...
Is TSMC putting all its Eggs (or Apples) in one Basket?
For those of us who attended Doug Yu’s keynote address at the 3D Architectures for Semiconductor Integration and Packaging Conference in December, yesterday’s keynote at IMAPS DPC was, in the words of the immortal George Carlin, “déjà vu all over again”; driving home the message that yes, TSMC intends to...
3D Panel Discusses the Evolving 2.5D/3D Infrastructure
Here’s something new from previous Device Packaging Conferences – rather than a panel largely populated by members of the EMC3D Consortium (ie: suppliers) moderated by either Jan Vardaman or Phil Garrou, the panel was populated by foundry and OSAT representatives, a fabless company, a market analyst, and still moderated by...
The Psychology of 3D Integration
Long before he set out on the 3D Holy Grail, Herb Reiter had other pursuits that involved bringing new technologies to market. Most notable is his work with field programable gate arrays ( FPGAs) and application specific ICs (ASICs), which, according to Reiter, actually started out as customer specific ICs...
