Yole News
Q2 2019: Memory Business is Approaching the Bottom
“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as...
5G: The Battle Still Rages
Consumer demand for mobile phones weakened in 2018, resulting in a market decline. In this context, the competition has intensified,...
Is Fan-Out packaging still popular? Equipment +; material companies are the heartbeats of this ecosystem
“Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established...Advanced Packaging Industry: A Wonderful World
The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the...
TOP 25 OSATs Ranking: Survival of the Fittest?
Out of the top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China,...
Advanced Substrates: The Winds of Change
Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation....
Advanced Packaging: Game Changer for Semiconductor Revolution
Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law...
The 5G Revolution is Pushing Innovations for RF front-end SiP
Without a doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular...Advanced Packaging: at the Heart of Innovation
The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt,...HPC, AI and Datacenters: the 2.5D & 3D Stacking Technologies Playground
“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter...Megatrends are Changing the Future of the Lithography Equipment Market
The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding...Fan-Out Packaging is Becoming Imperative to Stay Competitive in Advanced Packaging
“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and...
Packaging: Consumer Solutions Adapted for Automotive Applications
“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole)....
Polymeric Materials: Massive Adoption by the Advanced Packaging Industry
According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over... Advanced Packaging Technologies are Key for Semiconductor Innovation
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part...
The Advanced Packaging Industry is on the Move
Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts... Apple selected substrate-like PCBs for its latest iPhones. Who’s next?
The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are... The Memory Packaging Market Shows Steady Growth
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9%... 