Francoise News - Page 8
3D InCites’ Mural Project Raised $4000 For IMAPS Foundation
If you’ve attended the IMAPS Device Packaging Conference over the past three years, you probably noticed a hand-drawn mural coming...
3D System Integration – It Takes a Village
Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this...
Social Distancing Spotlight: ERS Celebrates 50 Years of Thermal Solutions
50 years of providing specialized thermal solutions to the semiconductor industry is a significant accomplishment. It means your company is...
ECTC 2020 Keynote: Moore’s Law 2.0 Brought to You by HIT
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately,...
Your Guide to Getting the Most out of Virtual ECTC 2020
One silver lining to COVID 19 for the microelectronics and advanced packaging communities is the ability to attend virtual ECTC...
Social Distancing Spotlight: A DBI Ultra Update
Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer...
IMAPS Announces a Suite of Virtual Learning Opportunities for the Semiconductor Packaging Industry
A live webinar on Recovery and Growth Areas After COVID-19 kicks off virtual programming May 20th. [May 15, 2020 –...
SemiSister Success Story: A Woman on the Edge of 3D Technology
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first...
Social Distancing Spotlight: NAMICS
Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites...
Not Even the Coronavirus can Stop the 5G Rollout, or Can It?
At last month’s IMAPS Device Packaging Conference, when I was not in keynote sessions, I was spending time chatting with...
Behind the Scenes of IEEE Std 1838™-2019
Developing an industry standard is no easy task, and for those involved, its acceptance and publication is something to be...
ACM Research Launches Stress-Free Polishing Tool for Advanced Packaging Applications; Delivers First Tool to Leading Chinese OSAT
Ultra SFP ap Provides Environmentally Friendlier Alternative to Conventional CMP for TSV and Fan-Out Wafer-Level Packaging Processes Fremont, California –...
An Inside Look at 3D-DfT Standard IEEE Std 1838™-2019
Eight years in the making, the IEEE Std 1838™-2019 Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits — or IEEE 1838,...
The Golden Age of Packaging Brought to you by Chiplet Integration
When people weren’t talking about the coronavirus at this year’s 2020 IMAPS Device Packaging Conference and its co-located Global Business...
2020 IEEE International Reliability Physics Symposium Changed to Virtual Conference; New Date April 28
Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a...
Coronavirus Gives Rubbing Elbows a New Meaning at IMAPS DPC 2020
As the domino effect of electronics industry event cancellations continued in response to the global threat of a potential Coronavirus...
Heterogeneous Integration Technology Gets its Own Competence Center
The team at EV Group has done it again. They looked around at where the microelectronics industry is headed, identified...
And the Winners of the 2020 3D InCites Awards Are…
The 2020 3D InCites Awards program has been a bit of a nail biter for us all, as we waited...
