Successful 3D Integration takes more than new technologies
In last week’s discussions in the design space — Is TSV a...
Francoise News - Page 55
Designers add their voice to the 3D integration journey
After being immersed in the 3D design world over the past few weeks I realized a few fundamental differences between...Wafer-Level Microlens Molding Process From EV Group Extends Manufacturing Roadmap for CMOS Image Sensors
EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it...Alchimer’s Electrografting Validated by RTI
Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, announced that...SPTS: A Wild Ride to Success
A year ago, things weren’t looking so great for Aviza Technologies. According to Kevin Crofton, executive VP, SPTS and managing...3D InCites’ Guide to Navigating theThird Dimension at SEMICON West
There’s no doubt about it, the 3D technology related workshops, lectures, and presentations happening at and around SEMICON West this...SUSS MicroTec sells test division to Cascade Microtech; forges alliance to address 3D TSV test
In a double-barreled press release, SUSS MicroTec announced the sale of its Test Systems Division to Cascade Microtech, Inc., a...3D makes the test community “To Do” list
I just finished putting together a presentation for the upcoming BiTS Workshop March 7-10, 2010 taking...Focus on 3D Design
Will this be the year for 3D IC design tools? Who knows for sure? But by the looks of the...Leti and R3Logic collaborate to develop 3D design methodologies
Global research center, Leti, located in Grenoble France,...Exercise your inquisitive mind
This year, both my daughters joined the high school debate team. Team parents are asked to judge tournaments from time...Congratulations, Bob Patti!
This is way too big a deal to just post a press release about. When I read the news on...3D R&D Round-up: MIT Lincoln Labs works on SOI
At MIT Lincoln Labs (MITLL), R&D processes developing 3D chips using silicon-on-insulator (SOI) wafers is the sole focus. As Phil...Canon Marketing Japan: A Causeway to the Japanese Market
It’s no secret that Japan has its own ideas of how to do pretty much everything. The culture is an...TSV Seminar Looks Back to the Future of Etch
Attending last week’s TSV Seminar in Tokyo, hosted by Electronic Journal, posed a bit of a challenge as all but...Bringing in the experts
It occurred to me recently that 3D InCites would benefit from having a technical advisory board.
2009 Reflections in 3D
It’s hard to believe I’ve been at this for a almost a year.
