SUSS MicroTec sells test division to Cascade Microtech; forges alliance to address 3D TSV test

In a double-barreled press release, SUSS MicroTec announced the sale of its Test Systems Division to Cascade Microtech, Inc., a worldwide supplier of precise electrical measurement and test of integrated circuits; as well as a strategic partnership between the two companies to address the growing device complexities of emerging semiconductor technologies such as 3D TSV manufacturing and test.

SUSS MicroTec Test Systems, located in Sacka near Dresden, Germany, has held the number 2 spot as global supplier of measurement and test systems for the semiconductor industry. Through its acquisition, Cascade Microtech will strengthen its position in the semiconductor test probe station market focusing the necessary resources towards developing leading-edge customer solutions to address accelerated growth markets.

“This is a key strategic move for Cascade Microtech that strengthens our product portfolio and leverages our combined resources and competencies,” said F. Paul Carlson, Chairman and CEO, Cascade Microtech, Inc. “We now have the critical mass to focus on the technical challenges our customers have in developing semiconductor processes and designing devices into the next decade. This acquisition enables us to aggressively address emerging applications such as 3D TSV, LED, and MEMS that are on an accelerated growth curve.”

With the divestment of the SUSS MicroTec Test Systems GmbH and the recent acquisition of HamaTech APE, SUSS MicroTec will focus on its core competency of microstructuring for microelectronics applications. “Divesting the SUSS MicroTec Test Systems GmbH allows us to focus on manufacturing solutions for our high growth core markets of advanced packaging, 3D integration, LED and MEMS’ said Frank P. Averdung, President and CEO of SUSS MicroTec. “Having a broad product range for 3D integration, we anticipate future collaboration with Cascade Microtech in order to address the complex issues in developing and testing 3D through silicon vias (TSVs).”

As such, the companies also announced that they have entered into a strategic partnership to address the growing device complexities of emerging semiconductor technologies such as 3D TSV manufacturing and test. Both companies will use their associations with leading research organizations such as IMEC, as well as industry partnerships, to gain insight into this cutting-edge methodology driving beyond Moore’s Law. Further collaboration with device and reliability experts will allow the alliance to address the complexities and interactions of semiconductor bonding and test probing for next-generation semiconductor devices.