Francoise News - Page 34
2013 Predictions for 3D ICs as told by Everyone – Part 1
It’s that time of year again when various electronics trade publications invite industry executives to peer into their crystal balls...More Tech Notes from 3D ASIP 2012
Oh yes, where was I before the holidays took over and hijacked my life for two weeks? I’ll bet you...Tying up 2012 3D IC Loose Ends
I don’t know about you, but I always find that amidst the holiday hubbub, the really important stuff gets shoved...Temporary Bond/Debond: Not Ready for 3D TSV Prime TIme
It’s too bad SUSS MicroTec’s Wilfried Bair was one of the last presenters on Friday at 3D Architecures for Systems...Fraunhofer IZM Update with M. Juergen Wolf
I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in...3D ASIP 2012: Damn the Torpedos! Full Speed Ahead!
After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear...3D IC Pioneers Continue to Lead the Way
For me, the most exciting news so far at this year’s 3D ASIP conference has been the announcement that Tezzaron...ACM Research: New Kid on the 3D Block
Yesterday at the pre-conference symposium for 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), I was fortunate to get an...Check this out: easier debonding?
It’s common knowledge among those working feverishly to bring 3D TSVs to market that one of the areas still being...The devil you know…..
Last March, when Rozalia Beica, of Semitool, gave a presentation updating the progress of the EMC-3D consortium at the IMAPS...Tour de France in 3D – Day 5
This whole week had been going so smoothly, I should have known I was due at least one mishap along...Tour de France in 3D – Day 4
Our visit to the St. Jeoire facility of Replisaurus/SET got off to a...Tour de France in 3D – Day 3
When it comes to fully understanding 3D integration processes, Sarah-Lyle Dampoux (my tour...Tour de France in 3D – Day One
Arrived in Paris, 6:55am. Checked in to L’hotel Petit Madeline 8:00am.

