Francoise News - Page 15
What’s in Store For You at IMAPS DPC 2017
Just under a week away, the agenda for the 2017 IMAPS Device Packaging Conference and co-located Global Business Council is...
Using 3D Integration to Get the Heat Out
Thermal management is one of the last vestiges of 3D integration challenges. As such, the European 3D Summit (Jan 23-25,...
Highlights from the 2017 European 3D Summit
The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging,...
The Edge of 3D: 3D SoC VLSI and Si Photonics
Last week, I posted an executive summary of this year’s European 3D Summit, touching on the highlights and general takeaways...
Welcome to a New Era of Predictive Yield Process Control for Advanced Packaging
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology...
2017 European 3D Summit: Making Advanced Packaging Great Again
Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced...
Top Ten Reasons to Attend the 2017 European 3D Summit
It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly...
Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next!
Sorry everybody, but I couldn’t resist this Buzzfeed-esque title, because Besi’s Hugo Pristauz’ unprecedented use of “colorful” language to illustrate...
3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition
In less than two weeks, the 13th Annual Architectures for Semiconductor Integration and Packaging Conference (3D ASIP) kicks off at...
What’s New for the 2017 European 3D Summit
For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over...
MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things
A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016)...
At the Crossroads of CVD and ALD, KOBUS Makes its Mark on 3D TSVs
Last July at SEMICON West, I was honored to witness the dramatic unveiling of UnitySC, the new company formed as...
SEMICON Europa 2017 Moves to Munich
So here’s a funny story. At the MEMS Summit in Stuttgart in September, while chatting with Denny McGuirk President and...
IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging
The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a...
At the 2016 S3S Conference, 3D Integration is Bringing Sexy Back
The IEEE S3S Conference (shorthand for the IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference; quite a mouthful, I know!) is an...
More Food for Thought From The 2016 European MEMS Summit
Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held September 15-16 in...
European MEMS Summit 2016: Are MEMS Manufacturers Richer than Last Year?
After the European MEMS Summit 2016 concluded on Friday afternoon (September 15-16, 2016), one of the attendees asked me which...
