Just under a week away, the agenda for the 2017 IMAPS Device Packaging Conference and co-located Global Business Council is...
Thermal management is one of the last vestiges of 3D integration challenges. As such, the European 3D Summit (Jan 23-25,...
The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging,...
Last week, I posted an executive summary of this year’s European 3D Summit, touching on the highlights and general takeaways...
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology...
Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced...
It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly...
Sorry everybody, but I couldn’t resist this Buzzfeed-esque title, because Besi’s Hugo Pristauz’ unprecedented use of “colorful” language to illustrate...
In less than two weeks, the 13th Annual Architectures for Semiconductor Integration and Packaging Conference (3D ASIP) kicks off at...
For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over...
A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016)...
Last July at SEMICON West, I was honored to witness the dramatic unveiling of UnitySC, the new company formed as...
So here’s a funny story. At the MEMS Summit in Stuttgart in September, while chatting with Denny McGuirk President and...
The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a...
The IEEE S3S Conference (shorthand for the IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference; quite a mouthful, I know!) is an...
Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held September 15-16 in...
After the European MEMS Summit 2016 concluded on Friday afternoon (September 15-16, 2016), one of the attendees asked me which...
Peter Clarke, EE Times, and I both agree – the biggest news of this year’s SEMI MEMS Summit, which took...
There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP)...
