Highlights from the 2017 European 3D Summit

Highlights from the 2017 European 3D Summit

The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging, 2.5D and 3D IC technologies being developed to achieve next-generation device requirements. In addition to informative sessions, attendees enjoyed some camaraderie, as we’ve all been meeting for a number of years to get 3D integration off the ground. The highlight of the year was by far the Gala Dinner, where we got to play in a photo booth, saw some cool magic tricks, and even learned a thing or two about wine.

2017 European 3D Summit in Review from 3D InCites on Vimeo.