The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging, 2.5D and 3D IC technologies being developed to achieve next-generation device requirements. In addition to informative sessions, attendees enjoyed some camaraderie, as we’ve all been meeting for a number of years to get 3D integration off the ground. The highlight of the year was by far the Gala Dinner, where we got to play in a photo booth, saw some cool magic tricks, and even learned a thing or two about wine.
2017 European 3D Summit in Review from 3D InCites on Vimeo.
